Abstract: The present process is for the manufacture of a monolithic read/write recording head for use in disk drives. The airborne slider body and the transducer nose portion of the head is made from the same magnetic ferrite material. The magnetic material preferably consists of NiZn ferrite or MnZn ferrite. A narrow track ridge has a non-magnetic gap interposed across the track at some distance atop the I-bar coil assembly, between the slider and the transducer portion. The instant process provides a self-aligned track ridge across the gap by virtue of machining the ridge in one bonded piece.For protection, this narrow gap and track ridge portion is glass encapsulated. Another embodiment of the instant process provides for a slider body equipped with both a servotype and data recording transducer assembly.The process provides attachment on a spring-loaded head holder in such a position that the spring axis is in parallel with the long dimension of the body along its air bearing surface.

Abstract: The present invention relates to a novel monolithic read/write recording head for use in disk drives. The airborne slider body and the transducer nose portion of the head is made from the same magnetic ferrite material. The magnetic material preferably consists of NiZn ferrite or MnZn ferrite. A narrow track surface has a non-magnetic gap interposed across the track at some distance atop the I-bar coil assembly, between the slider and the transducer portion. For protection, this gap and track area is embedded in molten glass. Another embodiment of the invention provides for a slider body equipped with both a servotype and data recording transducer assembly.The novel design provides attachment on a spring-loaded head holder in such a position that the spring axis is in parallel with the long dimension of the body along its air bearing surface. Alternatively, the head can have mounting blocks arranged such that the spring axis is directed perpendicularly to the long dimension of the body.

Abstract: An improved laminated beam lead for microelectronic devices, e.g., thin film resistors, integrated circuits or the like includes a first metal adhesion layer, e.g. tantalum nitride having disposed thereover a barrier metal such as palladium or platinum, and a bulk beam material, e.g., gold.In accordance with one aspect of the present invention, a transverse discontinuity is formed in the barrier metalization layer such that normal forces applied to the end portion of the composite beam lead remote from the device chip will merely cause the beam lead to deform at the discontinuity rather than delaminating from the chip.