Abstract: A TIG welding flux for chromium-molybdenum steel is used to form a weld bead with high mechanical strength and high fracture toughness between two chromium-molybdenum steel workpieces. The TIG welding flux for chromium-molybdenum steel includes 30-44 wt % of silicon dioxide (SiO2), 20-35 wt % of manganese(IV) oxide (MnO2), 14-24 wt % of chromium(III) oxide (Cr2O3), 9-19 wt % of nickel(III) oxide (Ni2O3), 7-14 wt % of molybdenum trioxide (MoO3) and 5-10 wt % of calcium fluoride (CaF2).

Abstract: The invention discloses a method for improving immunity in shrimps, by administering an extract of cocoa rind to a shrimp body to improve immunity of the shrimp body. The extract of cocoa rind is obtained by extracting a dried sample of cocoa rind by an aqueous ethanol solution with a concentration of ethanol being 90-98%. The dried sample of cocoa rind has a water content of 2-5%.

Abstract: A TIG welding flux for dissimilar steels is used to solve the problem that the conventional friction stir welding procedure for butt-joint welding a stainless steel workpiece and a carbon steel workpiece cannot be used on site, as well as the problem that the increased operating time and manufacturing cost due to forming bevel faces on both the stainless steel workpiece and the carbon steel workpiece. The TIG welding flux for dissimilar steels includes 25-35 wt % of silicon dioxide (SiO2), 20-30 wt % of cobalt (II, III) oxide (Co3O4), 15-20 wt % of manganese (II, III) oxide (Mn3O4), 10-15 wt % of nickel (III) oxide (Ni2O3), 7-12 wt % of molybdenum trioxide (MoO3), 6-11 wt % of manganese (II) carbonate (MnCO3), 5-10 wt % of nickel (II) carbonate (NiCO3), and 2-4 wt % of aluminum fluoride (AlF3).

Abstract: A welding flux for duplex stainless steel is used to solve the problem of insufficient penetration depth of a weld formed between two jointed workpieces when workpieces with a thickness above 3 mm is joined by TIG welding. The welding flux for duplex stainless steel includes 25-35 wt % of SiO2, 20-25 wt % of Cr2O3, 10-20 wt % of MoO3, 10-15 wt % of NiO, 5-10 wt % of FeO, 5-10 wt % of Co3O4, 5-10 wt % of MnO2 and 3-5 wt % of CuO.

Abstract: A ceramic composition which can be used as a sintering aid includes 1-2 mol % of magnesium oxide (MgO), 5-15 mol % of aluminum oxide (Al2O3), 25-40 mol % of silicon dioxide (SiO2), 40-55 mol % of calcium oxide (CaO), 0.1-8 mol % of ferric oxide (Fe2O3), 0.1-2 mol % of sulfur trioxide (SO3) and 0.1-2 mol % of titanium oxide (TiO2). Alternatively, the ceramic composition includes 1-8 mol % of MgO, 5-15 mol % of Al2O3, 25-40 mol % of SiO2, 40-55 mol % of CaO, 0.1-8 mol % of Fe2O3, 0.1-2 mol % of SO3 and 0.9-2 mol % of TiO2.

Abstract: A fusant F001 able to digest polysaccharides is formed by protoplast fusion between Bacillus amyloliquefaciens and Bacillus coagulans. The fusant F001 is deposited at NITE Patent Microorganisms Depositary (NPMD) in Japan with a deposit number NITE BP-02873.

Abstract: A hook assembly includes a base having a chamber, a hook portion provided on a bottom of the base, and a lean indicator mounted in the base via a second pivotal portion. The base includes an opening, a window portion, and an adhesion portion which is adhered to a surface. The adhesion portion and the opening are provided on a back plate. The base includes two first pivotal portions. A center of each first pivotal portion is spaced from the surface at a spacing. The lean indicator includes first and second faces. The first face has a feature different from that of the second face. A central axis of the second pivotal portion does not pass through a center of gravity of the lean indicator. The central axis of the second pivotal portion is spaced from each edge of the lean indicator at a distance slightly larger than the spacing.

Abstract: The invention provides an ignition flux for arc stud welding, including 30-55 wt % SiO2, 30-55 wt % NiO, 10-35 wt % AlF3, and 5-25 wt % NiF2, or including 30-55 wt % TiO2, 30-55 wt % NiO, 10-35 wt % AlF3, and 5-25 wt % NiF2. As such, the electric arc can be easily created and smoothly formed. The invention further provides an arc stud welding method utilizing such ignition flux. As such, the fastener and the metal workpiece can be tightly connected together without the need of inserting an ignition tip into the welding portion of a fastener.

Abstract: A thin film resistor includes 38-60 at.% of nickel, 10-25 at.% of chromium, 3-10 at.% of manganese, 4-18 at.% of yttrium, and 1-36 at.% of dysprosium. The thin film resistor can greatly increase the resistivity with a low temperature coefficient of resistance to broaden the applications of the thin film resistor.

Abstract: A medical drill bit comprises an accommodating slot disposed concavely on a main body of the medical drill bit, a separate board disposed in the accommodating slot to separate the accommodating slot into a first slot and a second slot, and a lid engaging with the separate board and covering the accommodating slot. The lid and the separate board do not rotate with the main body when the main body in rotation. The accommodating uses to fill with cooling liquid which able to be pumped out from the accommodating slot, and fresh cooling liquid is able to inject into the accommodating slot for cooling the drill bit in rotation.

Abstract: The present disclosure provides a welding flux used for austenitic stainless steel, which includes 20-40 wt. % SiC, 20-30 wt. % SiO2, 15-25 wt. % MoO3, 2-15 wt. % TiO2, 2-10 wt. % NiO, and 1-5 wt. % MgO. As such, the welding flux forms a soundness weld with high D/W ratio and surface hardness.

Abstract: A microfluidic chip for steam distillation includes a chip body and a condenser. The chip body includes a steam inlet and a steam outlet. The steam inlet is connected to the steam outlet by a micro channel. The micro channel includes a first channel, a second channel, and a receiving space having an enlarged cross sectional area larger than a cross sectional area of each of the first and second channels. The first channel connects the steam inlet with the receiving space. The second channel windingly connects the steam outlet with the receiving space. The condenser includes a condensing channel inlet and a condensing channel outlet. The condenser further includes a condensing channel windingly connecting the condensing channel inlet with the condensing channel outlet. The steam outlet 11b intercommunicates with the condensing channel inlet.

Abstract: The present invention provides a biochip image-forming system including a case having a cavity, an optical assembly, a chip-holding assembly and an electricity storage assembly. The cavity communicates with a chip inlet for a biochip to be inserted into the cavity through the chip inlet and an image outlet for an image of the biochip to be outputted from the cavity via the image outlet. The optical assembly is received in the cavity and aligned with the image outlet for forming the image of the biochip. The chip-holding assembly is received in the cavity and arranged between the optical assembly and a heating component. The chip-holding assembly aligns with the chip inlet for the biochip to be placed thereon. The electricity storage assembly is electrically connected with the optical assembly and the heating component. As such, a biochip can be analyzed conveniently using said biochip image-forming system.

Abstract: A welding activated flux for structural alloy steels including 40-50 wt % of SiO2, 25-30 wt % of MoO3, 5-10 wt % of TiO2 and 10-20 wt % of Cr2O3 is disclosed. Accordingly, with the use of the welding activated flux, the depth of the weld is significantly increased, thereby enhancing the mechanical strength of the weldment and reducing the distortion of the weldment.

Abstract: An electroless plating process includes providing a semiconductor substrate which has a substrate and a copper pillar disposed on the substrate; providing a tin-silver plating solution includes 0.1-50 wt % tin and 1×105-2 wt % silver; and performing a reduction reaction, wherein the semiconductor substrate is disposed in the tin-silver plating solution for making tin and silver of the tin-silver plating solution deposit jointly on the copper pillar surface to form a tin-silver co-deposition layer. The tin-silver co-deposition layer is able to enhance the coupling strength between the copper pillar of the semiconductor substrate and the other semiconductor substrate and is also able to reduce the time and cost of the process performing tin-plating and silver-plating separately.

Abstract: A despin device includes a central base installed in an outer rotational ring. The outer rotational ring includes a plurality of through-holes extending from an inner wall face thereof through an outer wall face thereof. Masses are symmetrically installed in ball grooves of the central base and the through-holes of the outer rotational ring. The masses are connected by a connecting line extending through a line cutter and tensioned by a tensioning device. Cables are wrapped around an outer periphery of the central base. Each cable includes an end attached to one of the masses. A plurality of release-hitch devices is provided. Each release-hitch device includes a hitch member fixed to the central base and a disengagement member releasably engaged with the hitch member and fixed to the other end of one of the cables.

Abstract: A microfluidic mixing device includes a body having a base, a sealing cover, and a thermally conductive member. The base includes a compartment. A chip access opening is defined in an end of the compartment. An engagement opening is defined in the other end of the compartment. The base further includes a gas port intercommunicated with the compartment. The sealing cover is detachably mounted to the base to seal the chip access opening. The thermally conductive member is mounted to the base and seals the engagement opening. A gas passage is defined between the thermally conductive member and an inner periphery of the base, is located in the compartment, and intercommunicates with the gas port. A pressure control module is connected to the gas port of the base. A heating module is coupled to the thermally conductive member. A cooling module is coupled to the thermally conductive member.

Abstract: A lined sleeve for tube welding is in the form of an inner tube including a first protruded portion and a second protruded portion. The first protruded portion and the second protruded portion are respectively received in two ends respectively of two tubes to be welded together. The inner tube further includes a recessed portion between the first protruded portion and the second protruded portion.

Abstract: A wind power and hydrogen power complex generating device includes a fan assembly having a blade unit and a demultiplexer connected to the blade unit. A heating unit is connected to a first output end of the demultiplexer. A pump is connected to a second output end of the demultiplexer. The pump pressurizes liquid water. A heating assembly is connected to the pump and the heating unit. The heating assembly heats the liquid water into a critical state. An electrolyzing unit includes an input end, a hydrogen output end, and an oxygen output end. The input end is connected to the heating assembly. The electrolyzing unit electrolyzes the liquid water in the critical state into gaseous hydrogen and gaseous oxygen. A fuel cell unit includes an anode passage connected to the hydrogen output end and a cathode passage connected to the oxygen output end.

Abstract: A supercapattery includes at least one tank filled with a conductive material. The conductive material has an arrangement-variable crystal lattice. The conductive material is graphite, grapheme, graphene oxide, a composite of graphite, metal, and a polymer, or a composite of graphene, metal, and a polymer. A magnetic member is mounted outside of the at least one tank. The magnetic member can be supplied with electricity to create a magnetic field. A method for controlling charge/discharge of a supercapattery includes supplying electricity to a supercapattery filled with a conductive material having an arrangement-variable crystal lattice. The crystal lattice of the conductive material supplied with electricity is transformed from an isotropic phase into an electro-nematic phase and absorbs electrons. An external magnetic field is created to return the crystal lattice of the conductive material from the electro-nematic phase to the isotropic phase, releasing the electrons.