Abstract: This disclosure describes a clear overmolding cap for protecting the photonic devices in optoelectronic packages from damage due to handling, module assembly, board assembly, and environmental exposure in field applications. The overmolding of the devices with a clear mold cap or similar material also provides a standoff for optical fibers positioned next to the active facets. The photonic devices are attached to a substrate, which may be flexible that has electronic traces that allow the photonic devices to be connected to an external device such as a semiconductor device. A technique for manufacturing the overmolding cap using a mold die system in combination with a rigid carrier is also disclosed. The rigid carrier is used to maintain the shape of the substrate during the molding process. The proposed method applies to photonic devices used in optoelectronic packages that can serve as transceivers, transmitters, or receivers.

Abstract: Methods of fabricating leadless packages are described that provide good solder joint reliability. In most respects, the packages are fabricated in a manner similar to current lead frame based leadless packaging techniques. However, at some point in the process, the contacts are provided with undercut regions that are left exposed during solder plating so that the solder plating also covers the exposed side and undercut segments of the contacts. When the resultant devices are soldered to an appropriate substrate (after singulation), each resulting solder joint includes a fillet that adheres very well to the undercut portion of contact. This provides a high quality solder joint that can be visually inspected from the side of the package.

Abstract: The present invention provides a low cost device that has a true die to external fiber optic connection. Specifically, the present invention relates to an optical device package joined to a semiconductor device package. In some cases, the combination is joined using wirebond studs and an adhesive material. In other cases, the combination is joined using an anisotropic conductive film. Yet, in other cases, the combination is joined using solder material. Each of these joining mechanisms provides high levels of thermal, electrical and optical performance. The joining mechanisms can apply to optical sub-assembly and chip sub-assembly interfaces in transceivers, transmitters, as well as receivers for opto-electronic packages.

Abstract: A high performance and small-scale circuitry substrate is described. The circuitry substrate includes a dielectric layer, a return plane attached to a bottom surface of the dielectric layer, and a plurality of return paths (ground) and signal lines that are attached to a top surface of the dielectric layer. The return paths on the top surface are connected to the return plane on the bottom surface by wrapping around at least one edge of the dielectric material. Return paths on the top layer can also separate each pair or adjacent signal lines. The circuitry substrate can be advantageously used to form an optoelectronic module.

Abstract: The present invention provides a technique for manufacturing a low cost device that provides a true die to external fiber optic connection. Specifically, the present invention relates to several techniques for joining an optical device package to a semiconductor device package. The first technique involves using wirebond studs and an adhesive material, the second technique involves the use of an anisotropic conductive film, and the third technique involves the use of solder material. Each of these techniques provides high levels of thermal, electrical and optical performance. The methods apply to optical sub-assembly and chip sub-assembly interfaces in transceivers, transmitters, as well as receivers for opto-electronic packages.

Abstract: The present invention provides a technique for manufacturing a low cost device that provides a true die to external fiber optic connection. Specifically, the present invention relates to several techniques for joining an optical device package to a semiconductor device package. The first technique involves using wirebond studs and an adhesive material, the second technique involves the use of an anisotropic conductive film, and the third technique involves the use of solder material. Each of these techniques provides high levels of thermal, electrical and optical performance. The methods apply to optical sub-assembly and chip sub-assembly interfaces in transceivers, transmitters, as well as receivers for opto-electronic packages.