Abstract: A method is provided for embedding electronic components including electrochemical cells within a circuit board substrate. The method includes micromachining the printed circuit board substrate to a selective depth to form a recess. A component is inserted into the recess and an electrical connection is established between the electrical component and a metallized pattern of the circuit board substrate using, e.g., laser direct-write.

Abstract: A method of bonding a wafer to a substrate comprising the steps of: providing a wafer having a front surface and a back surface; attaching the front surface of the wafer to a support; thinning the wafer from the back surface; bonding the back surface of the wafer to a substrate using a thin bonding technique; and removing the support from the front surface of the wafer. A circuit comprising: a substrate; and a wafer; wherein the wafer is at most about 50 microns thick; wherein the wafer has a front surface comprising features; and wherein the wafer has a back surface bonded to the substrate using a thin bonding technique.

Abstract: A laser-activated semiconductor switching device has a semiconductor structure housed in a semiconductor structure housing, and a laser array assembly directly connected to the semiconductor structure housing. The laser array assembly houses a plurality of laser diodes and diode control circuitry which energizes the laser diodes to emit light directly onto a surface of the semiconductor structure, which can be the cathode or anode surface, or both, to cause the semiconductor structure to generate current carriers which enable passage of current through the semiconductor structure. The surfaces of the semiconductor structure can be covered with metal layers having openings which permit the passage of the laser light into the semiconductor structure. The metal layers are reflective to the laser light and prevent the laser light that has passed into the semiconductor structure from exiting the structure to improve current carrier generation.

Abstract: A system and method for performing an electronic transaction, including registration, audit and trusted recovery features. A transaction request message is received from a registered user that includes an unblinded validated certificate, and a blinded unvalidated certificate. If the unblinded validated certificate is determined to be legitimate, then a transaction can be performed, and the blinded unvalidated certificate is validated to obtain a blinded, validated certificate that is sent to the user. An audit protocol can be used to further verify the legitimacy of the transaction request message, and a user can recover from a broken connection by replaying a protocol run.

Abstract: A feedback operated DC bridge circuit for monitoring the voltage variations in a voltage divider circuit using a voltage controlled resistance component to reach a null balance across the bridge. Amplification is provided at higher accuracy near the null point when the voltage difference across the bridge is zero. The feedback bridge circuit includes an integrator which directly drives the controlling component to the value of the resistance in an unknown branch to force the null condition. The voltage controlled component (configured as a discrete metal oxide semiconductor device or bipolar junction transistor) and the balancing scheme are suitable for microfabrication and provides noise-rejection enhancement. The interconnected integral feedback of the autonulling DC bridge enables both a neural network for pre-processing sensor input in a spatial domain as well as general analog computation that mimics a first order differential equation in the form of the system state equation.