Abstract: An optical switching system and method. The method includes tapping a first portion of an incoming data beam from an incoming source; and transferring the incoming data beam from the incoming source to a first path provided by a first MEMS based switching fabric. The method also transfers a monitoring source to monitor a second path of provided by second MEMS based switch fabric, while the second path of the second MEMS based switch fabric is in a stand by mode. A step of tapping a second portion of an outgoing data beam provided by the first MEMS based switching fabric is also included. The method determines if a process condition of the first path by at least the second portion of the outgoing data beam.

Abstract: A method (and system) for manufacturing an optical switching device. The method includes forming an array plate comprising at least one hundred sites from a first physical process, where each of the sites is for coupling to an optical fiber. The sites have a first spatial degree of error relative to an ideal mathematical grid of the sites. The first spatial degree of error is derived from at least the first physical process. The method forms a lens plate comprising a plurality of lenses from a second physical process. Each of the lenses is going to be coupled to at least one of the sites on the array plate. The lenses have a second spatial degree of error relative to a second mathematical grid of lenses. The second spatial degree of error is derived from at least the second physical process. The method then derives lens measurement values from each of the plurality of lenses.

Abstract: A method for fabricating a mirror array from multilayered substrate structures. The method forms a release layer overlying a material layer, which is formed on an insulating layer of multilayered substrate. The insulating layer is sandwiched between the material layer and a handle layer. As merely an example, the material layer is a silicon layer defined over a silicon dioxide layer on a silicon on insulator structure, commonly known as SOI. The method forms an opening in the release layer to expose a portion of the material layer. The method forms a torsion bar layer overlying the release layer and in the opening to connect to the material layer; and removes the release layer to hang the material layer from the torsion bar layer.

Abstract: A method for fabricating an array of mirrors disposed on a die from a substrate. The method includes placing a substrate comprising a plurality of die thereon on a stage. Each of the die comprises a plurality of movable mirror devices in an array configuration. Each die comprises a peripheral region defining a street that surrounds the array configuration. The method forms a plurality of tabs that join one die to another die in the street of the substrate. Each of the tabs also is separated from each other in a sequential manner by a recessed region between at least two of the tabs. The street defined by the tabs and the recessed region defined therebetween in a sequential manner.

Abstract: A method for switching signals using one of a plurality of mirrors in an array structure. The method includes determining an optical path to be formed between an input fiber and an output fiber. The method also includes determining a set of mirrors to be used to form the optical path. The set of mirrors includes at least a first mirror. The first mirror is coupled to a mechanical spring assembly and an actuation assembly. The method captures an analog signal indicative of a spatial position of the first mirror using a position sensing device. The sensing device is coupled to the mirror. The method also converts the signal analog signal into a digital signal. The method processes the digital signal indicative of the spatial position of the mirror using the digital signal processing device to obtain a characteristic of the mirror. The method provides a control signal based upon the characteristic of the mirror. The converts the control signal into an analog control signal.

Abstract: In an optical switching system, a method for providing redundant out of band communication. The method includes receiving an update of information from a network; and calculating route information based upon the update of information. The method updates route forwarding information based upon the route information in a first volatile memory location; and updates route forwarding information based upon the route information in a second volatile memory location.

Abstract: An integrated circuit and mirror device. The device includes a first substrate comprising a plurality of electrode groups, wherein each of the groups comprises a plurality of electrodes. A mirror array is formed on a second substrate. Each of the mirrors on the array has a mirror surface being able to pivot about a point (e.g., fixed point, region) in space. Each of the mirrors has a backside surface operably coupled to one of the electrode groups. A bonding layer mechanically couples the first substrate to the second substrate, whereupon the backside surface of each mirror faces one of the electrode groups. The device also has a drive circuitry coupled to each electrode groups. The drive circuitry is configured to apply a voltage to any one of the electrodes in each of the electrode groups. The drive circuitry is disposed in the first substrate and being adapted to pivot each of the mirror faces about the point in space.

Abstract: A method (and system) for communicating between at least two optical switching systems. Each of the optical switching systems includes an optical cross-connect coupled to an incoming fiber bundle and coupled to an outgoing fiber bundle. The method determines a control channel from a plurality of available channels. The plurality of available channels is provided on one or more optical fibers. The plurality of optical fibers are coupled between a first optical switch system and a second optical switch system. The method also opens an internal communication loop for the control channel between a first multiplexing device coupled to the first optical switch system and a second multiplexing device coupled to the second optical switch system. The method also includes forming a connection between the first optical switch system and the second optical switch system during a period of time that the internal communication loop has been opened.

Abstract: An integrated circuit and mirror device. The device includes a first substrate comprising a plurality of electrode groups, wherein each of the groups comprises a plurality of electrodes. A mirror array is formed on a second substrate. Each of the mirrors on the array has a mirror surface being able to pivot about a point (e.g., fixed point, region) in space. Each of the mirrors has a backside surface operably coupled to one of the electrode groups. A bonding layer mechanically couples the first substrate to the second substrate, whereupon the backside surface of each mirror faces one of the electrode groups. The device also has a drive circuitry coupled to each electrode groups. The drive circuitry is configured to apply a voltage to any one of the electrodes in each of the electrode groups. The drive circuitry is disposed in the first substrate and being adapted to pivot each of the mirror faces about the point in space.

Abstract: An integrated circuit and mirror device and method. The device has a first substrate comprising a plurality of electrode groups, which comprise a plurality of electrodes. The device also has a mirror array formed on a second substrate. Each of the mirrors on the array has a mirror surface being able to pivot about a point in space. Each of the mirrors has a backside surface operably coupled to one of the electrode groups. The device has a capacitance spacer layer disposed between each of the electrode groups and its respective mirror. The mirror is one from the mirror array. A drive circuitry is coupled to each electrode groups. The drive circuitry is configured to apply a drive voltage to any one of the electrodes in each of the electrode groups. The drive circuitry is also disposed in the first substrate and is adapted to pivot each of the mirror faces about the point in space.

Abstract: A method for fabricating a mirror array from a silicon on insulator substrate structure. The method includes providing a silicon-on-insulator (SOI) substrate structure, which may have a material thickness of greater than 10 microns overlying an insulating layer. The SOI material thickness is of a single crystal silicon bearing material. The method also patterns the material thickness using a deep reactive ion etching process to pattern a mirror device structure by forming a trench region that extends from a surface of the material thickness to the insulator structure; and patterns the thickness of material to form a recessed region coupled to the trench region to define a torsion bar structure. The recessed region extends from the surface of the material thickness and is less than about 80% of the mirror device thickness. The method forms an opening on a back side of the SOI substrate structure to the insulator structure.

Abstract: An optical deflection device. The device includes a substrate (e.g., silicon, silicon on insulator) comprising a plurality of die thereon. Each of the die has a plurality of movable mirror devices in an array configuration. Each of the movable mirrors is supported by at least one torsion bar to a frame structure, which is formed on the substrate. Each of the die also has a peripheral region defining a street that surrounds the array configuration to define the die. A plurality of tabs is formed in the street to join one die to another die on the substrate. At least two of the tabs are separated from each other in a sequential manner by a recessed region defined there between. The tabs and the recessed region are positioned to each other in a sequential manner.