Abstract: The present invention enables deniable zero-knowledge interactive proof to be performed with low amounts of communications and calculations by utilizing a method of a special honest verifier zero-knowledge interactive proof when such method is given. The verification apparatus generates a commitment of a challenge value with respect to a predetermined relationship and transmits the commitment of the challenge value to the proving apparatus, which determines whether or not a required relationship using the commitment of the challenge value holds, and stops its operation if such relationship does not hold. The proving apparatus causes the proof commitment generation apparatus to generate a proof commitment and transmits the proof commitment to the verification apparatus, which transmits a challenge value and a random number to the proving apparatus.

Abstract: A top surface of a LSI chip having a structure of a bare chip is provided with bumps, and a protective resin is provided for at least side surfaces of the LSI chips. The LSI chip is prevented from being chipped off or cracked because of protective resin provided for the side surfaces of the LSI chip. The invention provides a semiconductor device and a method for fabricating the same, in which the chip or a package thereof is prevented from being damaged, and thereby yield rate of the semiconductor device can be heightened. Since the numbers of the parts of the semiconductor device and the steps of using jigs and tools necessary for the fabrication process are reduced, fabricating cost of the semiconductor device can be cut down.