Abstract: The present invention provides a probe test apparatus capable of easily correcting a probe needle of a probe card. A pad image by which the position of an electrode pad P can be specified is captured from a semiconductor wafer, and the captured pad image is stored. While capturing a probe image by which the position of the tip Q of a probe needle can be specified from a probe card, the probe image is displayed while being overlaid on the inverted pad image in a real time manner. Since the positional relation of the probe needle with respect to the electrode pad P is displayed in a real time manner, at the time of correcting a probe needle with tweezers or the like with reference to the image, the operator can correct the probe needle while observing the state of the probe needle in a real time manner.