Patents Assigned to NEC Schott Components Corporation
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Patent number: 9460883Abstract: A temperature fuse includes a cylindrical metal case, a sliding electrode slidable over an inner surface of the metal case, and a terminal electrically connected to the metal case while the sliding electrode is in contact therewith, during activation, the sliding electrode moving away from the terminal so that electrical connection between the metal case and the terminal is cut off, the sliding electrode being formed by working a thin metal plate, the sliding electrode including at least a base material layer composed of copper or a copper alloy and a first surface layer composed of silver or a silver alloy, and a site of contact with the terminal being the first surface layer having a thickness not smaller than 5 ?m.Type: GrantFiled: November 19, 2012Date of Patent: October 4, 2016Assignee: NEC SCHOTT Components CorporationInventor: Tokihiro Yoshikawa
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Patent number: 8884165Abstract: An object of the present invention is to provide a chip-size packaging device at low cost that achieves size reduction, thickness reduction, weight reduction, and further, high reliability, by using a glass substrate with a through electrode. The packaging device according to the present invention is characterized in that a glass substrate having a plurality of through electrodes arranged at a predetermined position is used as a base member for a package that houses a device element having a group of electrodes, and the group of electrodes and the through electrodes are led out to an external circuit with a contact medium arranged to bypass a sealant being interposed between the group of electrodes and the through electrodes.Type: GrantFiled: June 22, 2009Date of Patent: November 11, 2014Assignee: NEC SCHOTT Components CorporationInventor: Hiroshi Kamada
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Publication number: 20140306794Abstract: A temperature fuse includes a cylindrical metal case, a sliding electrode slidable over an inner surface of the metal case, and a terminal electrically connected to the metal case while the sliding electrode is in contact therewith, during activation, the sliding electrode moving away from the terminal so that electrical connection between the metal case and the terminal is cut off, the sliding electrode being formed by working a thin metal plate, the sliding electrode including at least a base material layer composed of copper or a copper alloy and a first surface layer composed of silver or a silver alloy, and a site of contact with the terminal being the first surface layer having a thickness not smaller than 5 ?m.Type: ApplicationFiled: November 19, 2012Publication date: October 16, 2014Applicant: NEC SCHOTT Components CorporationInventor: Tokihiro Yoshikawa
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Patent number: 8420933Abstract: A high-pressure-resistant hermetic seal terminal includes an eyelet which has a through hole and a lead which is electrically insulated and hermetically sealed via a glass material in the through hole. The glass material is welded in a manner to extend on a lower surface of the eyelet from an end of the through hole to surroundings of the end of the through hole. Preferably, the eyelet has a counterbore, in the lower surface, extending in a region around and surrounding the through hole, and the glass material is welded to the inside of the counterbore.Type: GrantFiled: April 6, 2010Date of Patent: April 16, 2013Assignee: NEC Schott Components CorporationInventors: Hidehiko Harada, Norifumi Kitamura, Hiroyuki Kojima
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Publication number: 20120018216Abstract: A high-pressure-resistant hermetic seal terminal includes an eyelet which has a through hole and a lead which is electrically insulated and hermetically sealed via a glass material in the through hole. The glass material is welded in a manner to extend on a lower surface of the eyelet from an end of the through hole to surroundings of the end of the through hole. Preferably, the eyelet has a counterbore, in the lower surface, extending in a region around and surrounding the through hole, and the glass material is welded to the inside of the counterbore.Type: ApplicationFiled: April 6, 2010Publication date: January 26, 2012Applicant: NEC SCHOTT COMPONENTS CORPORATIONInventors: Hidehiko Harada, Norifumi Kitamura, Hiroyuki Kojima
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Publication number: 20110108308Abstract: An object of the present invention is to provide a chip-size packaging device at low cost that achieves size reduction, thickness reduction, weight reduction, and further, high reliability, by using a glass substrate with a through electrode. The packaging device according to the present invention is characterized in that a glass substrate (11) having a plurality of through electrodes (11b) arranged at a predetermined position is used as a base member for a package that houses a device element having a group of electrodes, and the group of electrodes and the through electrodes (11b) are led out to an external circuit with a contact medium arranged to bypass a sealant (14) being interposed between the group of electrodes and the through electrodes (11b).Type: ApplicationFiled: June 22, 2009Publication date: May 12, 2011Applicant: NEC SCHOTT COMPONENTS CORPORATIONInventor: Hiroshi Kamada
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Patent number: 7843307Abstract: A thermal fuse employing a thermosensitive pellet is provided, which exhibits stabilized characteristics in a low operating temperature region. The thermal fuse includes at least a switching movable member, a thermosensitive pellet member, a pair of leads having a first lead portion and a second lead portion, and a metal casing. The thermosensitive pellet member contains a polyolefin wax. The thermosensitive pellet member is housed in the metal casing to which the pair of leads are attached. The switching movable member is operated by deformation associated with softening or melting of the thermosensitive pellet member, to attain a cut-off state between the pair of leads. The thermal fuse employing a thermosensitive pellet is suitable for an operating temperature of 50 to 180° C.Type: GrantFiled: September 23, 2008Date of Patent: November 30, 2010Assignee: NEC SCHOTT Components CorporationInventor: Tokihiro Yoshikawa
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Patent number: 7709922Abstract: A thermistor device having a high-speed response to temperature and a large ON/OFF ratio at the operating temperature. The thermistor device comprises a first layer of a first material having a positive temperature coefficient of resistance and a second layer of a second material having a semiconductivity and formed directly on the first layer. As the first material changes from conductive to a semiconductive or an insulative at or near the transition temperature TM-I, the interface between the first and second layer changes to a pn junction.Type: GrantFiled: March 17, 2005Date of Patent: May 4, 2010Assignees: Toudai TLO, Ltd., NEC SCHOTT Components CorporationInventors: Hidenori Takagi, Yoshinobu Nakamura, Kouhei Fujiwara
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Publication number: 20090179729Abstract: A thermal fuse includes a metallic casing, a first lead member having a first electrode formed at an end thereof, a second lead member having a second electrode formed at an internal wall surface of the casing, a switching function member including a spring member pressing a thermosensitive pellet and a movable conductor. At an operating temperature as the thermosensitive pellet softens and melts, the thermal fuse switches an electrical circuit between the first and second electrodes. In order to respond and switch more quickly at the operating temperature, the thermosensitive pellet is produced to have a structure that facilitates activation thereof at the operating temperature. Such a structure may involve at least one cavity incorporated in the pellet, or may involve at least two different resin materials that are mixed together or provided in plural layers in the pellet.Type: ApplicationFiled: March 18, 2009Publication date: July 16, 2009Applicant: NEC SCHOTT Components CorporationInventor: Tokihiro Yoshikawa
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Patent number: 7529072Abstract: A protection apparatus is provided that can use a thermal fuse at higher voltage and higher current. The protection apparatus includes a protection circuit connected in series between a power supply and a load. The protection circuit includes a thermal fuse with a predetermined operating temperature, activated in response to sensing overheating of the power supply and/or load, and an electrosensitive fuse connected in parallel with the thermal fuse, and activated at a predetermined operating current. The electrosensitive fuse is adapted to be activated only after the thermal fuse has been activated at the predetermined operating temperature.Type: GrantFiled: July 26, 2006Date of Patent: May 5, 2009Assignees: NEC SCHOTT Components Corporation, Honda Motor Co., Ltd.Inventor: Masahiro Nishikawa
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Publication number: 20090091417Abstract: A thermal fuse employing a thermosensitive pellet is provided which uses a new substance exhibiting stabilized characteristics as a thermosensitive material used in the case where the thermal fuse employing a thermosensitive pellet has an operating temperature in a low temperature region. The thermal fuse employing a thermosensitive pellet of the present invention includes at least a switching movable member, a thermosensitive pellet member, a pair of leads having a first lead portion and a second lead portion, and a metal casing, in which the thermosensitive pellet member contains a polyolefin wax, the thermosensitive pellet member is housed in the metal casing to which the pair of leads are attached, the switching movable member is operated by deformation associated with softening or melting of the thermosensitive pellet member, to attain a cut-off state between the pair of leads, and the thermal fuse employing a thermosensitive pellet is suitable for an operating temperature of 50 to 180° C.Type: ApplicationFiled: September 23, 2008Publication date: April 9, 2009Applicant: NEC SCHOTT Components CorporationInventor: Tokihiro Yoshikawa
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Patent number: 7362208Abstract: In order to prevent erroneous operation caused by shrinking of a thermal pellet due to sublimation or softening of the thermal pellet when current is applied, a thermal pellet type thermal fuse includes a metal casing, a first lead and a second lead leading out from the metal casing, a movable electrode, a thermal pellet, a strong compression spring, and a weak compression spring. Difference in temperature is achieved at the surface of the metal casing by selecting different diameters or wires for the first lead and the second lead, or by providing a heat-radiating plate.Type: GrantFiled: September 15, 2005Date of Patent: April 22, 2008Assignee: NEC SCHOTT Components CorporationInventors: Tokihiro Yoshikawa, Masahiro Nishikawa
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Patent number: 7330098Abstract: There is provided a thermal fuse employing a thermosensitive pellet that reacts to an operating temperature with limited variation, and operates with high precision and hence high reliability. To achieve this, the thermal fuse includes a switching function member including a thermosensitive pellet, a movable conductor, and a spring member. At a prescribed operating temperature the thermosensitive pellet softens or melts to liberate the spring member from a load to cause the spring member to move the movable conductor to switch an electrical circuit located between first and second lead members. The thermosensitive pellet is formed of a thermosensitive material selected depending on a characteristic in flowability presented as it softens or melts.Type: GrantFiled: August 12, 2005Date of Patent: February 12, 2008Assignee: NEC SCHOTT Components CorporationInventor: Tokihiro Yoshikawa
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Patent number: 7323966Abstract: A thermal fuse incorporating a thermal pellet has its operating temperature, or heat distortion temperature, adjusted and the thermosensitive material of the pellet avoids deformation, modification or similar deficiency if it is exposed to a severe external environment. The inexpensive thermal fuse provides a wider range from which an operating temperature can be selected, improved insulation resistance after operation, faster response speed in operation, and enhanced strength of the thermal pellet. The thermosensitive material is formed of a thermoplastic resin corresponding to a high molecular weight substance. The thermal pellet's heat distortion temperature is adjusted by a temperature setting method. An enclosure of the fuse has a metal casing with a spring member's strong and weak compression springs both accommodated therein and hermetically sealed.Type: GrantFiled: October 22, 2004Date of Patent: January 29, 2008Assignee: NEC SCHOTT Components CorporationInventor: Tokihiro Yoshikawa
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Patent number: 7323965Abstract: In the present invention, a physical and chemical property of thermosensitive material is noted in selecting and using thermosensitive material to provide a noble and improved thermal fuse using thermosensitive material. To achieve this object, the present thermal fuse includes: a thermosensitive material formed of thermoplastic resin fusing at a prescribed temperature; a cylindrical enclosure accommodating the thermosensitive material; a first lead member attached at one opening of the enclosure, forming a first electrode; a second lead member attached at the other opening of the enclosure, forming a second electrode; a movable conductive member accommodated in the enclosure and engaged with the thermosensitive material; and a spring member accommodated in the enclosure, and pressed against and thus acting on the movable conductive member. When the thermosensitive material fuses at an operating temperature an electrical circuit between the first and second electrodes is switched.Type: GrantFiled: April 22, 2003Date of Patent: January 29, 2008Assignee: NEC SCHOTT Components CorporationInventor: Tokihiro Yoshikawa
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Publication number: 20070025042Abstract: A protection apparatus is provided that can use a thermal fuse at higher voltage and higher current. The protection apparatus includes a protection circuit connected in series between a power supply and a load. The protection circuit includes a thermal fuse with a predetermined operating temperature, activated in response to sensing overheating of the power supply and/or load, and an electrosensitive fuse connected in parallel with the thermal fuse, and activated at a predetermined operating current. The electrosensitive fuse is adapted to be activated only after the thermal fuse has been activated at the predetermined operating temperature.Type: ApplicationFiled: July 26, 2006Publication date: February 1, 2007Applicants: NEC SCHOTT Components Corporation, HONDA MOTOR CO., LTDInventor: Masahiro Nishikawa
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Publication number: 20060232372Abstract: To faster respond to switch at an operating temperature a thermal fuse employing a thermosensitive pellet includes a metallic casing, a first lead member having a first electrode formed at an end thereof, a second lead member having a second electrode formed at an internal wall surface of the casing, a switching function member including a spring member pressing the thermosensitive pellet and a movable conductor. At the operating temperature as the thermosensitive pellet softens and melts, the thermal fuse switches an electrical circuit between the first and second electrodes, and it is characterized in that the thermosensitive pellet undergoes a process to facilitate activation to allow the thermal fuse to faster respond to switch at the operating temperature.Type: ApplicationFiled: April 5, 2006Publication date: October 19, 2006Applicant: NEC SCHOTT Components CorporationInventor: Tokihiro Yoshikawa
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Publication number: 20060208845Abstract: There is provided a thermal fuse employing a thermosensitive pellet providing an operating temperature with limited variation, and operating with high precision and hence highly reliably. To achieve this, the thermal fuse employing the thermosensitive pellet includes a switching function member including a thermosensitive pellet, a movable conductor, and a spring member. At a prescribed operating temperature the thermosensitive pellet softens or melts to liberate the spring member from a load to cause the spring member to move the movable conductor to switch an electrical circuit located between the first and second lead members. The thermosensitive pellet is formed of a thermosensitive material selected depending on a characteristic in flowability presented as it softens or melts.Type: ApplicationFiled: August 12, 2005Publication date: September 21, 2006Applicant: NEC SCHOTT Components CorporationInventor: Tokihiro Yoshikawa
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Patent number: 6977339Abstract: A surface mounting package includes a metal base with a lower surface having a through hole, a metal lead arranged to be inserted into the through hole, an insulating material filling in an internal space defined by the metal base, a cap covering the metal base as a lid, and an electronic part component arranged at a surface on the internal space side of the metal lead. The internal space is held at an air-tight atmosphere. The metal base has a lower surface positioned on the same plane as a lower surface of the metal lead or the insulating material, the same plane forming a plane to be attached to a mounting board.Type: GrantFiled: September 12, 2002Date of Patent: December 20, 2005Assignee: NEC Schott Components CorporationInventor: Daisuke Fukushima
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Publication number: 20050088272Abstract: There is provided a thermosensitive material allowing a thermal pellet incorporated thermal fuse's operating temperature, or heat distortion temperature, to be adjusted and preventing deformation, modification or similar deficiency if it is exposed to severe external environment, and there is provided an inexpensive thermal fuse that provides a wider range from which an operating temperature is selected, improved insulation resistance after operation, faster response speed in operation, and enhanced strength of the thermal pellet. To do so, the thermosensitive material is formed of thermoplastic resin corresponding to a high molecular substance, the thermal pellet's heat distortion temperature is adjusted by a temperature setting method, and an enclosure has a metal casing with a spring member's strong and weak compression springs and both accommodated therein and hermetically sealed.Type: ApplicationFiled: October 22, 2004Publication date: April 28, 2005Applicant: NEC SCHOTT Components CorporationInventor: Tokihiro Yoshikawa