Abstract: In an AC adapter provided with a circuit board having first and second surfaces opposite to each other in a thickness direction, a transformer portion is mounted on the circuit board. A secondary capacitor is connected to an output side of the transformer portion. The secondary capacitor has a low profile and extending in parallel to the circuit board. Thus, the AC adapter as a whole is reduced in external size. Preferably, the transformer portion is mounted on the first surface while the secondary capacitor is mounted on the second surface.

Abstract: An external cathode terminal (16) is adhered to one surface of a capacitor element while a prepreg (25) is adhered to another surface of the capacitor element. A reinforcement plate (26) is adhered to the prepreg. Heat and pressure are applied to the external cathode terminal, the prepreg, and the reinforcement plate to elute thermosetting resin from the prepreg in the side of the capacitor element, thereby sealing the side of the capacitor element with eluted material (27A, 27B). Inasmuch as transfer molding is not used as exterior package, the element never deforms by injection pressure of resin. It is possible to thin by a thickness of exterior package resin. Inasmuch as eluted thermosetting resin does not include a mold release agent, it has good adhesion for the external cathode terminal.

Abstract: In order to provide an electronic component of a high frequency current suppression type, which can completely suppress a high frequency current to prevent an electromagnetic interference from occurring even when it is used at a high frequency, and a bonding wire for the same, the semiconductor integrated circuit device (IC) (17) operates at a high speed in using at a high frequency band, and a predetermined number of terminals (19) are provided with a high frequency current suppressor (21) for attenuating a high frequency current passing through the terminals themselves. This high frequency current suppressor (21) is a thin film magnetic substance having a range from 0.3 to 20 (?m) in thickness, and is disposed on the entire surface of each terminal (19), covering a mounting portion to be mounted on a printed wiring circuit board (23) for mounting IC (17) and an edge including a connecting portion to a conductive pattern (25) disposed on the printed wiring circuit board (23).

Abstract: There is provided a composite magnetic tape which can be easily applied irrespective of the inside or outside of an electronic equipment, prevent radiation of undesired electromagnetic waves from the inside of the equipment and reflection into the inside of the equipment, and shield electromagnetic noise from the outside of the equipment. The tape may be in the form of an adhesive tape or a self-welding tape. The tape is constituted of a composite magnetic layer formed by dispersing soft magnetic powder into an organic binding agent. Alternatively, it may have a stacked structure of a composite magnetic layer and a conductor layer.

Abstract: In order to provide an electronic component of a high frequency current suppression type, which can completely suppress a high frequency current to prevent an electromagnetic interference from occurring even when it is used at a high frequency, and a bonding wire for the same, the semiconductor integrated circuit device (IC) (17) operates at a high speed in using at a high frequency band, and a predetermined number of terminals (19) are provided with a high frequency current suppressor (21) for attenuating a high frequency current passing through the terminals themselves. This high frequency current suppressor (21) is a thin film magnetic substance having a range from 0.3 to 20 (&mgr;m) in thickness, and is disposed on the entire surface of each terminal (19), covering a mounting portion to be mounted on a printed wiring circuit board (23) for mounting IC (17) and an edge including a connecting portion to a conductive pattern (25) disposed on the printed wiring circuit board (23).

Abstract: In an electronic component (11) comprising an electronic circuit or a circuit element in a metallic case including a case (13) and a cover (39), a magnetic thin film (51) made of a magnetic loss material is provided on at least one part of an inner wall surface of the metallic case. In the magnetic loss material, its composition is represented by M-X—Y, wherein M denotes at least one of Fe, Co and Ni, X denotes at least one of elements other than M and Y, and Y denotes at least one of F, N and O. The maximum value &mgr;″max of an imaginary part &mgr;″, which is an imaginary number component of a complex permeability of the magnetic loss material, exists within a frequency range from 100 MHz to 10 GHz.

Abstract: In a composite magnetic body comprising flat soft magnetic powder dispersed in an organic binding agent, biodegradable plastic is used as the organic binding agent so that the composite magnetic body is free of possibility of pollution due to disposal thereof. As the biodegradable plastic, any of a microbe-generated type, a chemically-synthesized type and a natural high molecular weight type is used.