Abstract: In a method of manufacturing a solid electrolytic capacitor, at first, an anodic oxide film is formed on the surface of an aluminum base. Then, a solid electrolyte layer is formed of a conductive polymer or the like on the anodic oxide film. Then, a cathode electrode portion including a silver paste layer is formed on the solid electrolyte layer. Then, a conductive paste is coated on the anodic oxide film on one side of the aluminum base and cured, thereby forming a metal silver layer. Then, a laser beam is irradiated from the opposite side of the aluminum base to weld together the aluminum base and the metal silver layer, thereby forming an anode electrode portion.

Abstract: The present invention provides a solid electrolytic capacitor having sufficiently low impedance at high frequencies in which a conductive polymer formed on a dielectric oxide film has good adherence to the dielectric oxide film, and a manufacturing method of the solid electrolytic capacitor. The solid electrolytic capacitor of the present invention includes a valve metal; a dielectric oxide film layer formed on a surface of the valve metal; and a solid electrolyte layer, comprising a conductive polymer layer, formed on the dielectric oxide film layer. The conductive polymer layer contains, as an additive, 0.1 wt % to 30 wt % of an organic oligomer having an average degree of polymerization of 2 to 100.

Abstract: In a lead frame for use in fabricating a face-down terminal solid electrolytic capacitor having a capacitor element an anode terminal, and a cathode terminal, a frame body has a connecting portion for being connected to the capacitor element. The connecting portion extends from a cathode terminal forming portion in a first direction to a position near an anode terminal forming portion. The anode terminal forming portion is connected to the frame body and used for forming the anode terminal. The cathode terminal forming portion is connected to the frame body and used for forming the cathode terminal. The anode terminal forming and the cathode terminal forming portions are spaced to each other in the first direction on a principal surface of the frame body.

Abstract: A stacked battery sealed by a film casing shows a raised degree of resistance against vibrations.

Abstract: An electromagnetic relay is provided which enables a coating process with a coating agent even after being mounted on a printed circuit board having undergone reflow heating by preventing invasion of water while maintaining air permeability. A main body making up the electromagnetic relay includes an electrical contact portion, electromagnetic driving portion and molded resin base and is covered with the molded resin cover. One or more through holes are formed by applying laser beam from a rear side of the molded resin cover. A spot diameter of each through hole on a surface of an outside of the molded resin cover is 0.1 ?m to 10 ?m. Instead of the molded resin cover, through-holes each having a size of 0.1 ?m to 10 ?m may be formed by applying the laser beam to the molded resin base.

Abstract: A viscous material (4) is obtained by mixing an alloy magnetic powder, magnetized in advance, with a resin. The viscous material (4) thus obtained is applied to an upper surface of a center magnetic leg of an E-shaped core (2). A coil (3) and an I-shaped core are coupled to the E-shaped core (2). An orientation magnetic field is applied by a permanent magnet (5) while the resin is hardened. As a consequence, a bond magnet is obtained which is formed in tight contact with both of a pair of surfaces defining a magnetic gap between the E-shaped core (2) and the I-shaped core.

Abstract: A solid electrolytic capacitor according to this invention includes a capacitor element with a drawn-out anode lead, a conversion substrate mounted with the capacitor element, and a casing resin covering the capacitor element mounted on the conversion substrate. The conversion substrate has, on one surface thereof, a connection pattern composed of an anode portion connected to the anode lead and a cathode portion connected to the body of the capacitor element. The conversion substrate further has, on another surface thereof on the side opposite to the foregoing one surface, a terminal pattern composed of an anode terminal and a cathode terminal connected to the anode portion and the cathode portion through the conversion substrate, respectively. The terminal pattern differs from the connection pattern.

Abstract: A solid electrolytic capacitor manufacturing method includes a process of removing a roughened surface layer (10a?) from a distal portion (13) of a metal member (10) and from part of an intermediate portion (12) adjacent to the distal portion (13), a process of forming a resist (40) on the distal portion (13) and the intermediate portion (12) of the metal member (10), a process of forming a conductive polymer layer (30) of a conductive polymer on a proximal portion (11) of the metal member (10), and a process of removing a resist (40?) and a surface layer portion (13?) of the metal member (10) from the distal portion (13) of the metal member (10).

Abstract: In a solid electrolytic capacitor including a porous valve-acting metal, an anode conductor has a large number of pores having openings on the surface thereof according to the porosity of the valve-acting metal. A solid electrolyte layer is formed on the surface of the anode conductor so as to be filled in at least a portion of each of the pores and to close the openings thereof. Further, a cathode conductor is formed on the solid electrolyte layer. Preferably, the solid electrolyte layer has a two-layer structure with two layers having different particle sizes.

Abstract: A solid electrolytic capacitor with face-down terminals includes a capacitor element having an anode lead drawn out therefrom in an offset manner, an anode terminal, a cathode terminal, and an insulating casing resin. At a rectangular mount surface having a first and a second side parallel to each other and forming an outer bottom portion, four terminal exposed portions are provided such that a terminal pair composed of the two terminal exposed portions are located at the first side and a terminal pair composed of the other two terminal exposed portions are located at the second side. The two terminal exposed portions located at the first side serve as mount-surface exposed portions of the anode terminal and the cathode terminal, while, the two terminal exposed portions located at the second side serve as dummy terminals that are not electrically connected to the capacitor element.

Abstract: A solid electrolytic capacitor is provided which is capable of exhibiting an excellent characteristic and high reliability against thermal stress. The solid electrolytic capacitor includes a base member having a capacitor element connecting face on its upper surface side and an electrode mounting face on its lower surface side and being made up of an insulating plate having first conductors and second conductors, disposed in a staggered format, each providing conduction between the upper and lower surface sides of the base member, and the capacitor element having anode portions and cathode portions, each being disposed in a staggered format, connected to each of the first and second conductors.

Abstract: A multiterminal solid electrolytic capacitor includes a capacitor element including a porous sintered body which includes a plurality of anode leads projecting from a surface of the porous sintered body and which is made from a valve metal powder, a dielectric oxide coating disposed on the porous sintered body, and a cathode including a solid electrolyte layer disposed on the dielectric oxide coating. The multiterminal solid electrolytic capacitor further includes a substrate which carries the capacitor element, which includes a plurality of anode-mounting terminals and a cathode-mounting terminal, and which is covered with resin. The anode leads are portions of a valve metal pattern which extends in the porous sintered body and which bends at a plurality of locations so as to have a desired path length.

Abstract: Magnetic attractive force of a magnet exerted on a movable contact in a sealing case through yokes changes as a result of movement of a magnetic shunt element induced by movement of a movable element located outside the sealing case. As a result, the movable contact can be brought into or out of contact with a stationary contact without involvement of entry of the movable element into the sealing case.

Abstract: To provide a Ti—Ni—Nb alloy device which is a shape memory device excellent in response characteristics. The Ti—Ni—Nb alloy device is made of a Ti—Ni—Nb alloy which finishes transformation at a temperature lower than 10° C. after start of reverse transformation.

Abstract: A method for manufacturing a solid electrolytic capacitor has the steps of: mixing valve metal powders with organic binder for granulation, press-molding granulated powders embedded with a valve metal lead, sintering a press-molded compact in vacuum to produce a sintered body, and anodizing the sintered body to form a dielectric oxide film layer. The method further has a step of performing a cathode electrolytic cleaning to the sintered body before the step of forming the dielectric oxide film layer. The cathode electrolytic cleaning is performed in an acid solution, which is a mixed acid solution of hydrofluoric acid, nitric acid, and sulfuric acid.

Abstract: An electromagnetic noise suppressor including a ferrite film is formed by regularly arranging constituents such as magnetized grains or one analogous to that. In the ferrite film, the constituents have at least one of the uniaxial anisotropy and the multiaxial anisotropy. The ferrite film has the magnetic anisotropy or the magnetic isotropy. The ferrite film is formed by a plating method in the presence of a magnetic field.

Abstract: A multilayer printed circuit board includes an inner magnetic layer essentially consisting of magnetic material. The inner magnetic layer may be formed by an action of chemical bond or van der Waals force. The inner magnetic layer may comprise a plurality of magnetic units, each of which provides magnetism, and may be formed by magnetically coupling the magnetic units with each other by using a strong interaction. The inner magnetic layer may essentially consist of a ferrite film. The ferrite film may be formed directly on the inner conductive layer by means of an electroless plating method. The ferrite film may essentially consist of an oxide metal composition, the metal composition being represented by the formula of FeaNibZncCod, where: a+b+c+d=3.0; 2.1?a?2.7; 0.1?b?0.3; 0.1?c?0.7; and 0?d?0.15.

Abstract: On a surface-roughened aluminum foil, an aluminum oxide film as an anodic oxide film is formed. Then, a conductive polymer layer as a solid electrolyte is formed thereon and thereafter a first metal plating layer is directly formed on the conductive polymer layer, thereby forming a cathode portion. On the other hand, a second metal plating layer is formed on another portion of the surface-roughened aluminum foil, which is not subjected to anodic oxidation or which is subjected to anodic oxidation followed by polishing or formation of an anode deposition film, to thereby form an anode portion. Third metal plating layers are formed at the anode and the cathode portions to obtain a capacitor element. A plurality of capacitor elements are stacked and bonded together fusion after formation of the third metal plating layers. Alternatively the capacitor elements may be bonded together by conductive paste without the third metal layers.