Patents Assigned to NEC TOPPAN CIRCUIT SOLUTION, INC.
  • Method of manufacturing optical waveguide and method of manufacturing OPTO-electric wiring board
    Publication number: 20030128907
    Abstract: After an optical waveguide substrate including a supporting substrate is adhered to an electric wiring board, the supporting substrate alone is dissolved using an organic solvent for removal. Alternatively, the supporting substrate alone is melted through a thermal treatment for removal. Further, a core layer of an optical waveguide is formed on the substrate using a photosensitive resin having a thermal expansion coefficient substantially identical to that of the supporting substrate.
    Type: Application
    Filed: November 26, 2002
    Publication date: July 10, 2003
    Applicant: NEC TOPPAN CIRCUIT SOLUTION, INC.
    Inventors: Hideo Kikuchi, Mikio Oda, Hikaru Kouta, Sakae Kitajo, Yuzo Shimada