Abstract: A semiconductor module includes a wiring board having a bottom surface and a top surface. A first solder electrode terminal has a given melting point, and is provided on the bottom surface of the wiring board. An electrode pad is provided on or above the top surface of the wiring board, and a second solder electrode terminal is soldered to the electrode pad at a temperature corresponding to the given melting point of the first solder electrode terminal by using a reflow process. The second solder electrode terminal contains an additional metal powder component diffused therein when being soldered to the electrode pad.