Abstract: An electroplating apparatus including an elongated, hollow conductive anode tube having first and second ends, an inner conductive surface, and an outer conductive surface from which sacrificial plating metal may be suspended. An elongated cathode conductor is disposed within the hollow conductive anode tube, the cathode conductor having first and second ends, corresponding to the first and second ends of the anode tube, and an outer conductive surface. An insulation layer is placed between the outer surface of the cathode conductor and the inner surface of the anode tube. Power and ground cables respectively connect a power supply to the first end of the anode tube and the first end of the cathode conductor, and a conductive jumper connects the second end of the cathode conductor to an elongated cathode bar, from which articles to be plated may be suspended.