Patents Assigned to Neobule Technologies, Inc.
  • Multi-chip module single package structure for semiconductor
    Patent number: 7786490
    Abstract: The invention is to provide a semiconductor light-emitting device package structure. The semiconductor light-emitting device package structure includes a substrate, N sub-mounts and N semiconductor light-emitting die modules, where N is a positive integer lager than or equal to 2. Each of the sub-mounts is embedded on the substrate and exposed partially. Each of the semiconductor light-emitting die modules is mounted on the exposed surface of one of the sub-mounts.
    Type: Grant
    Filed: November 28, 2005
    Date of Patent: August 31, 2010
    Assignee: Neobule Technologies, Inc.
    Inventor: Jen-Shyan Chen