Patents Assigned to Neomax Material Co., Ltd.
  • Method of making a solder ball
    Patent number: 7265046
    Abstract: A solder ball 50 according to the present invention includes a spherical core 2 and a solder layer 4, which includes Sn and Ag and which is provided so as to wrap the core 2 up. The amount of water contained in the solder layer 4 is 100 ?l/g or less when represented by the amount of water vapor in standard conditions.
    Type: Grant
    Filed: September 24, 2003
    Date of Patent: September 4, 2007
    Assignee: Neomax Material Co., Ltd.
    Inventors: Masuo Kondo, Fumiaki Kikui