Patents Assigned to NeoPac Semiconductor Corp.
  • Method for improving the liquid dispensing of IC packages
    Publication number: 20010001070
    Abstract: A flat plate mold with special treatment or a metallic flat plate mold is adopted to flatten the resin painted over on IC chips during package dispensing process, such that it is able to maintain a consistent flatness of the surface of IC products after dispensing for laser or ink marking. And heat sinks can be attached to the flat plate mold to increase the heat-dissipating rate of IC products after dispensing.
    Type: Application
    Filed: December 26, 2000
    Publication date: May 10, 2001
    Applicant: NeoPac Semiconductor Corp.
    Inventors: Chi-Hsing Hsu, Chin-Hsing Chung, Wen-Fu Hsu