Abstract: A robot for cleaning and inspecting conduits has a synchronizing mechanism, which extends all driving units simultaneously and with a constant normal force applied to the conduit wall. The robot may be equipped with adapters for conduits with rectangular cross section, and with extension bars for conduits with large diameters. Further, the robot may be equipped with sensors monitoring the robot status, these include a sensor of the synchronizing mechanism position, inclinometer and gyroscope. Data from these sensors may be displayed on a monitor. The movement of the robot inside the conduit and therefore the speed of individual tracks is controlled by the operator by three control elements: direction of turning, diameter of bend and speed of motion. The robot is also able to travel backwards inside the conduit automatically based on stored information about forward movement.

Abstract: A robot for cleaning and inspecting conduits has a synchronizing mechanism, which extends all driving units simultaneously and with a constant normal force applied to the conduit wall. The robot may be equipped with adapters for conduits with rectangular cross section, and with extension bars for conduits with large diameters. Further, the robot may be equipped with sensors monitoring the robot status, these include a sensor of the synchronizing mechanism position, inclinometer and gyroscope. Data from these sensors may be displayed on a monitor. The movement of the robot inside the conduit and therefore the speed of individual tracks is controlled by the operator by three control elements: direction of turning, diameter of bend and speed of motion. The robot is also able to travel backwards inside the conduit automatically based on stored information about forward movement.

Abstract: Disclosed is a Light Emitting Diode (LED) for an electric signboard. The LED can prevent formation of shade caused by a coated silicon layer while minimizing the weight and thickness of the electric signboard. Further, the LED protects an internal LED chip by using a transparent hemispheric cap having scattering property, and a chip die is mounted on a Printed Circuit Board (PCB) while closely making contact with the surface of the PCB, so that thickness and weight of silicon coated on the surface of the PCB can be minimized.