Abstract: A semiconductor package is provided. The semiconductor package can include a first redistributed layer on which a plurality of semiconductor chips and a plurality of passive devices are mounted on one surface, a second redistributed layer electrically connected to the first redistributed layer through a via, an external connection terminal formed on the lower surface of the second redistributed layer, a first mold provided to cover the plurality of semiconductor chips and the plurality of passive devices on the first redistributed layer, and a second mold provided between the first redistributed layer and the second redistributed layer. Each of the first redistributed layer and the second redistributed layer includes a wiring pattern and an insulating layer and is composed of a plurality of layers, and at least one of the plurality of semiconductor chips is disposed between the first redistributed layer and the second redistributed layer.

Abstract: A semiconductor package includes a semiconductor chip having at least one chip pad disposed on one surface thereof; a wiring pattern disposed on top of the semiconductor chip and having at least a portion thereof in contact with the chip pad to be electrically connected to the chip pad; and a solder bump disposed on outer surface of the wiring pattern to be electrically connected to the chip pad through the wiring pattern.

Abstract: A semiconductor package and a manufacturing method thereof are provided. The semiconductor package includes a lower structure including a semiconductor chip having a chip terminal; an external connection terminal connecting the semiconductor chip to an external device; and an intermediate connection structure including an upper surface and a lower surface opposite to the upper surface, and positioned between the lower structure and the external connection terminal.

Abstract: A semiconductor package comprising a fan-out structure and a manufacturing method therefor are disclosed. A semiconductor package according to an embodiment of the present invention comprises: a wiring unit comprising an insulation layer and a wiring layer; a semiconductor chip mounted on the wiring unit and coupled to the wiring layer by flip-chip bonding; a filling member for filling a gap between the semiconductor chip and the wiring unit; and a film member for performing coating so as to cover one surface of each of the semiconductor chip, the filling member, and the wiring unit.

Abstract: A technical idea of the present disclosure provides a semiconductor package, as a semiconductor package mounted on a circuit board, including: a body portion including a semiconductor chip, and a first surface and a second surface opposite to each other; and a structure including n insulating layers stacked on at least one of the first surface and the second surface of the body portion, wherein the semiconductor package has a predetermined target coefficient of thermal expansion (CTE), and the n insulating layers and the body portion have a thickness and a CTE satisfying a condition that an effective CTE of the semiconductor package becomes equal to the predetermined target CTE.

Abstract: A semiconductor package according to an exemplary embodiment of the present disclosure may comprise a semiconductor chip comprising a chip pad; a redistribution layer electrically connected to the chip pad of the semiconductor chip; an external connection terminal electrically connected to the redistribution layer; a sealing material covering the semiconductor chip and configured to fix the semiconductor chip and the redistribution layer; an adhesive film positioned on the upper surface of the sealing material; and a heat sink formed on the upper surface of the adhesive film and having a stepped portion at the periphery thereof.

Abstract: A semiconductor package having improved impact resistance and excellent heat dissipation and electromagnetic wave shielding property, and a manufacturing method thereof are provided. There is provided a semiconductor package including: a chip having a contact pad provided on one surface thereof; a buffer layer formed on one surface of the chip; one or more wiring patterns disposed on the buffer layer, electrically connected to the contact pad of the chip, and extended to an outside of the chip; an external pad provided on the wiring pattern and electrically connected to the wiring pattern; an external connection terminal electrically connected to the external pad; and a mold layer formed to surround the other surface and a side surface of the chip and a side surface of the buffer layer, and formed up to the other surface of the wiring pattern.

Abstract: Disclosed is a semiconductor package including a semiconductor chip having a first surface adjacent to an active layer and a second surface opposite to the first surface; a conductive stud disposed on the first surface of the semiconductor chip and connected to the active layer; an adhesive layer disposed on the second surface of the semiconductor chip; a conductive post disposed outside the semiconductor chip; a first redistribution structure, which is on the first surface of the semiconductor chip and includes a first redistribution insulation layer supporting the conductive stud and the conductive post; a second redistribution structure, which is on the second surface of the semiconductor chip and includes a second redistribution insulation layer disposed on the adhesive layer; and a first molding layer disposed on the first redistribution structure and surrounding the semiconductor chip, the adhesive layer, the conductive stud, and the conductive post.

Abstract: Provided is a semiconductor package including a first semiconductor chip having a bottom surface adjacent to a first active layer and an top surface opposite to the bottom surface; a first adhesive layer disposed on the top surface of the first semiconductor chip; a first conductive stud disposed on the bottom surface of the first semiconductor chip and electrically connected to the first active layer; a first conductive post disposed outside the first semiconductor chip; a redistribution structure disposed under the first semiconductor chip and including a redistribution pattern connected to the first conductive stud and the first conductive post and a redistribution insulation layer surrounding the redistribution pattern; and a molding layer surrounding the first semiconductor chip, the first adhesive layer, the first conductive stud, and the first conductive post on the redistribution structure.

Abstract: A semiconductor package includes a semiconductor chip including a chip pad on a first surface thereof, an external pad electrically connected to the chip pad of the semiconductor chip, an external connection terminal covering the external pad, and an intermediate layer between the external pad and the external connection terminal, the intermediate layer including a third metal material that is different from a first metal material included in the external pad and a second metal material included in the external connection terminal.

Abstract: A semiconductor package includes an upper structure including a semiconductor chip and a first molding layer for molding the semiconductor chip, a lower structure provided on the upper structure, the lower structure including a conductive post and a second molding layer for molding the conductive post, and a redistribution structure provided between the upper structure and the lower structure, the redistribution structure including a wiring pattern for electrically connecting a pad of the semiconductor chip to the conductive post, in which a thermal expansion coefficient of the second molding layer is different from a thermal expansion coefficient of the first molding layer.

Abstract: A semiconductor package includes a semiconductor chip including a chip pad, a first insulating layer provided on the semiconductor chip and including a first via hole, a first wiring pattern provided on the first insulating layer and connected to the chip pad through the first via hole of the first insulating layer, a second insulating layer provided on the first insulating layer and the first wiring pattern and including a second via hole, and a second wiring pattern provided on the second insulating layer and connected to the first wiring pattern through the second via hole of the second insulating layer, wherein the first insulating layer includes a first upper surface in contact with the second insulating layer and a first lower surface opposite to the first upper surface, and the first upper surface of the first insulating layer has surface roughness greater that the first lower surface of the first insulating layer.

Abstract: A semiconductor package is provided. The semiconductor package can include a first redistributed layer on which a plurality of semiconductor chips and a plurality of passive devices are mounted on one surface, a second redistributed layer electrically connected to the first redistributed layer through a via, an external connection terminal formed on the lower surface of the second redistributed layer, a first mold provided to cover the plurality of semiconductor chips and the plurality of passive devices on the first redistributed layer, and a second mold provided between the first redistributed layer and the second redistributed layer. Each of the first redistributed layer and the second redistributed layer includes a wiring pattern and an insulating layer and is composed of a plurality of layers, and at least one of the plurality of semiconductor chips is disposed between the first redistributed layer and the second redistributed layer.

Abstract: A semiconductor package includes a semiconductor chip having at least one chip pad disposed on one surface thereof; a wiring pattern disposed on top of the semiconductor chip and having at least a portion thereof in contact with the chip pad to be electrically connected to the chip pad; and a solder bump disposed on outer surface of the wiring pattern to be electrically connected to the chip pad through the wiring pattern.

Abstract: A semiconductor package and a manufacturing method thereof are provided. The semiconductor package includes a lower structure including a semiconductor chip having a chip terminal; an external connection terminal connecting the semiconductor chip to an external device, and an intermediate connection structure including an upper surface and a lower surface opposite to the upper surface, and positioned between the lower structure and the external connection terminal.

Abstract: A semiconductor package includes a first package including a first semiconductor chip, a first encapsulation layer that covers the first semiconductor chip, and a first redistribution pattern connected to pads of the first semiconductor chip and a second package on the first package, the second package including a second semiconductor chip, a second encapsulation layer that covers the second semiconductor chip, and a second redistribution pattern connected to pads of the second semiconductor chip. The first redistribution pattern is connected to the second redistribution pattern through the first encapsulation layer.

Abstract: The present invention relates to a semiconductor package and a method of manufacturing the same. In a semiconductor package which electrically connects a semiconductor chip and a printed circuit board using a solder ball, the semiconductor package further includes a thermal buffer layer which is positioned on a semiconductor chip, absorbs and disperse heat generated by the semiconductor chip, increases a distance between the semiconductor chip and a printed circuit board to decrease a deviation of a heat conduction process, and has a thickness ranging from 7.5 to 50% of a diameter of a solder ball.

Abstract: A semiconductor package having improved impact resistance and excellent heat dissipation and electromagnetic wave shielding property, and a manufacturing method thereof are provided. There is provided a semiconductor package including: a chip having a contact pad provided on one surface thereof; a buffer layer formed on one surface of the chip; one or more wiring patterns disposed on the buffer layer, electrically connected to the contact pad of the chip, and extended to an outside of the chip; an external pad provided on the wiring pattern and electrically connected to the wiring pattern; an external connection terminal electrically connected to the external pad; and a mold layer formed to surround the other surface and a side surface of the chip and a side surface of the buffer layer, and formed up to the other surface of the wiring pattern.

Abstract: Provided are a semiconductor package and a method of manufacturing the same, the semiconductor package including an interconnection part including an insulation layer and an interconnection layer, a semiconductor chip disposed on the interconnection part and electrically connected to the interconnection layer through a bonding pad, and an EMI shielding part connected to the interconnection layer while covering the semiconductor chip and the interconnection part.

Abstract: A semiconductor package according to an exemplary embodiment of the present disclosure may comprise a semiconductor chip comprising a chip pad; a redistribution layer electrically connected to the chip pad of the semiconductor chip; an external connection terminal electrically connected to the redistribution layer; a sealing material covering the semiconductor chip and configured to fix the semiconductor chip and the redistribution layer; an adhesive film positioned on the upper surface of the sealing material; and a heat sink formed on the upper surface of the adhesive film and having a stepped portion at the periphery thereof.