Patents Assigned to Nepes LED Corporation
  • Patent number: 8436391
    Abstract: An LED leadframe package with surface tension function to enable the production of LED package with convex lens shape by using dispensing method is disclosed. The LED leadframe package of the invention is a PPA supported package house for LED packaging with metal base, four identical metal electrodes, and PPA plastic to fix the metal electrodes and the heat dissipation base together, four ring-alike structures with a sharp edge and with a tilted inner surface, and three ring-alike grooves formed between sharp edge ring-alike structures.
    Type: Grant
    Filed: April 28, 2010
    Date of Patent: May 7, 2013
    Assignee: Nepes Led Corporation
    Inventors: Nguyen The Tran, Yongzhi He, Frank Shi
  • Patent number: 8350453
    Abstract: A lamp cover containing phosphor for providing white light emission is disclosed. The lamp cover is comprised of a light-partial-reflective cap structure providing the outer surface of the lamp cover, wherein the light-partial-reflective cap structure is composed of a plurality of light transparent layers and a plurality of vacuum layers that are stacked in an alternating manner from outside to inside, a supporting transparent cap structure providing the inner surface of the lamp cover, and a phosphor mixed structure mechanically supported by the outer surface of the supporting transparent cap structure, wherein the outer surface of the phosphor mixed structure is adjacent to the most inner vacuum layer of the light-partial-reflective cap structure. Once the lamp cover is combined with a phosphor exciting light source, the light-partial-reflective cap structure partially prevents phosphor exciting light from escaping from the lamp cover by using Fresnel reflection.
    Type: Grant
    Filed: May 25, 2010
    Date of Patent: January 8, 2013
    Assignee: Nepes LED Corporation
    Inventors: Nguyen The Tran, Yongzhi He, Frank Shi
  • Publication number: 20110291548
    Abstract: A lamp cover containing phosphor for providing white light emission is disclosed. The lamp cover is comprised of a light-partial-reflective cap structure providing the outer surface of the lamp cover, wherein the light-partial-reflective cap structure is composed of a plurality of light transparent layers and a plurality of vacuum layers that are alternatively stacked from outside to inside, a supporting transparent cap structure providing the inner surface of the lamp cover, and a phosphor mixed structure mechanically supported by the outer surface of the supporting transparent cap structure, wherein the outer surface of the phosphor mixed structure is adjacent to the most inner vacuum layer of the light-partial-reflective cap structure. Once the lamp cover is combined with a phosphor exciting light source, the light-partial-reflective cap structure partially prevents phosphor exciting light from escaping from the lamp cover by using Fresnel reflection.
    Type: Application
    Filed: May 25, 2010
    Publication date: December 1, 2011
    Applicant: NEPES LED CORPORATION
    Inventors: Tran NGUYEN THE, Yongzhi He, Frank Shi
  • Patent number: 8058667
    Abstract: An LED leadframe package with surface tension function to enable the production of LED package with convex lens shape by using dispensing method is disclosed. The LED leadframe package of the invention is a PPA supported package house for LED packaging with metal base, four identical metal electrodes, and PPA plastic to fix the metal electrodes and the heat dissipation base together, four ring-alike structures with a sharp edge and with a tilted inner surface, and three ring-alike grooves formed between sharp edge ring-alike structures.
    Type: Grant
    Filed: March 10, 2009
    Date of Patent: November 15, 2011
    Assignee: Nepes LED Corporation
    Inventors: Nguyen The Tran, Yongzhi He, Frank Shi
  • Patent number: 8039862
    Abstract: A white light emitting diode (LED) package with multilayered encapsulation structure and the packaging methods are disclosed. The white LED package structure includes metal electrodes, a heat dissipation base, a PPA plastic for fixing the electrodes and the heat dissipation base together, at least one LED die, a die attaching material, gold wires for electrically connecting the LED die to the electrodes, a first type of silicone encapsulant, a second type of silicone encapsulant, and a phosphor containing layer. The invention utilizes a low-refractive index silicone (the second type of silicone encapsulant) to separate the phosphor containing layer away from the first type of silicone, which covers the LED die, to prevent/reduce emitted light going backward and hitting the LED die.
    Type: Grant
    Filed: March 10, 2009
    Date of Patent: October 18, 2011
    Assignee: Nepes LED Corporation
    Inventors: Nguyen The Tran, Yungzhi He, Frank Shi
  • Patent number: 7972023
    Abstract: An LED lamp cover structure containing luminescent material and its fabrication methods are described. The LED lamp cover is comprised of a first lens cap providing the outer surface of the lamp cover, a second lens cap providing the inner surface of the lamp cover, and an encapsulating layer sandwiched between the lens cap providing the outer surface of the lamp cover and the lens cap providing the inner surface of the lamp cover, which is mixed with luminescent material for wavelength conversion.
    Type: Grant
    Filed: March 10, 2009
    Date of Patent: July 5, 2011
    Assignee: Nepes LED Corporation
    Inventors: Nguyen The Tran, Yongzhi He, Frank Shi
  • Patent number: 7828453
    Abstract: An LED lamp cover structure containing luminescent material, its fabrication methods, and an LED package using the LED lamp cover are disclosed. The LED lamp cover is comprised of a first lens cap providing the outer surface of the lamp cover, a second lens cap providing the inner surface of the lamp cover, and an encapsulating layer sandwiched between the first and second lens caps. The lamp cover of the invention covering a color LED package such as blue color can provide white light output.
    Type: Grant
    Filed: August 3, 2009
    Date of Patent: November 9, 2010
    Assignee: Nepes LED Corporation
    Inventors: Nguyen The Tran, Yongzhi He, Frank Shi
  • Publication number: 20100230791
    Abstract: An LED leadframe package with surface tension function to enable the production of LED package with convex lens shape by using dispensing method is disclosed. The LED leadframe package of the invention is a PPA supported package house for LED packaging with metal base, four identical metal electrodes, and PPA plastic to fix the metal electrodes and the heat dissipation base together, four ring-alike structures with a sharp edge and with a tilted inner surface, and three ring-alike grooves formed between sharp edge ring-alike structures.
    Type: Application
    Filed: April 28, 2010
    Publication date: September 16, 2010
    Applicant: NEPES LED CORPORATION
    Inventors: Nguyen The Tran, Yongzhi He, Frank Shi