Abstract: A wafer-level package includes a first die and a second die that are wafer-level packaged. The first die has a first clock source. The second die has a second clock source. The first clock source generates a clock shared by the first die and the second die. The second clock source, however, does not generate a clock used by any of the first die and the second die.

Abstract: A semiconductor die assembled in a wafer-level package includes a communication interface and a bus master. The bus master is coupled to a communication bus through the communication interface. The bus master communicates with a bus slave of another semiconductor die assembled in the wafer-level package via the communication bus, and is controlled by a flow control mechanism that manages a transaction flow initiated by the bus master over the communication bus.

Abstract: A wafer-level package has a first die and a second die. The first die has a first clock source arranged to generate a first clock, a first sub-system arranged to generate transmit data, and an output circuit arranged to output the transmit data according to the first clock. The second die has a second sub-system, a second clock source arranged to generate a second clock, and an input circuit having an asynchronous first-in first-out (FIFO) buffer. The input circuit buffers the transmit data transferred from the output circuit in the asynchronous FIFO buffer according to the first clock, and outputs the buffered transmit data in the asynchronous FIFO buffer to the second sub-system according to the second clock.

Abstract: A packet processing apparatus has an ingress packet processing circuit, an egress packet processing circuit, and a traffic manager. The ingress packet processing circuit processes ingress packets received from ingress ports. The egress packet processing circuit processes egress packets to be forwarded through egress ports. The traffic manager deals with at least packet queuing and scheduling. At least one of the ingress packet processing circuit and the egress packet processing circuit includes a first packet processing unit located at a first packet flow path, and a second packet processing unit located at a second packet flow path. The first packet flow path is parallel with the second packet flow path, and programmability of the first packet processing unit is higher than programmability of the second packet processing unit.