Patents Assigned to NETEERA TECHNOLOGIES LTD.
  • Patent number: 11633122
    Abstract: The present invention provides a method and a portable non-invasive sub-THz and THz (THz) radar system for remotely detecting physiological parameters of a subject, comprising: one or more transmission means for transmitting THz signals to a subject predefined tissue; one or more reception means for receiving a THz signal of the subject, the THz signals being a reflection of the THz signal from subject tissue thereby, receiving at least one physiological parameter change; and microprocessor means coupled and configured to communicate with the transmitter means and/or the reception means for receiving and processing the reflected signals.
    Type: Grant
    Filed: February 14, 2019
    Date of Patent: April 25, 2023
    Assignee: NETEERA TECHNOLOGIES LTD.
    Inventors: Yochanan Steinberg, Yizhaq Litman
  • Patent number: 10998614
    Abstract: An antenna pattern integrated-on-chip for transmitting and/or receiving sub-terahertz and terahertz (THZ) signal& The antenna pattern comprising: a first conductor having a bi-circular structure; a second conductor having a bi-circular structure connected to the first bi-circular structure. The bi-circular structures comprising a first conductive circular lobe having a radius (Rx) and a second circular lobe having a radius (Rc), such that said Rx?Rc. The first bi-circular and the second bi-circular characterized by at least one port thereby, having an area of intersection between the first bi-circular and the second lei-circular, forming an ultra-wideband (UWB) frequency response of more than about 100% bandwidth.
    Type: Grant
    Filed: May 22, 2018
    Date of Patent: May 4, 2021
    Assignee: NETEERA TECHNOLOGIES LTD.
    Inventors: Uzi Tomo, Haim Goldberger
  • Patent number: 10224363
    Abstract: An imaging sensor for accepting terahertz signals, including a die made of a dielectric material, one or more antennas for receiving terahertz signals, positioned on top of the die or in an upper layer of the die, each antenna having a CMOS detector electrically coupled to the antenna and positioned in the die below the antenna, a metal shield layer in the die below the antennas and above the CMOS detectors, shielding the CMOS detector from interference signals, a shielding layer under the die comprising a back metal coating and/or a layer of silver epoxy glue for attaching the bottom of the die to a lead frame.
    Type: Grant
    Filed: June 29, 2017
    Date of Patent: March 5, 2019
    Assignee: NETEERA TECHNOLOGIES LTD.
    Inventors: Haim Goldberger, Péter Földesy, Omer Eshet