Abstract: A process of calibrating a model, the process including: obtaining training data including: scattered radiation information from a plurality of structures, individual portions of the scattered radiation information being associated with respective process conditions being characteristics of a patterning process of the individual structures; and calibrating a model with the training data by determining a ratio relating a change in one of the process characteristics to a corresponding change in scattered radiation information.

Abstract: A radiation source apparatus comprising: a container for being pressurized with a gaseous medium in which plasma which emits plasma emitted radiation is generated following excitation of the gaseous medium by a driving radiation, wherein said container is operable substantially to remove radiation with a wavelength of 10-400 nm from said plasma emitted radiation before said plasma emitted radiation exits said container as output radiation. In an embodiment the container comprises: an inlet radiation transmitting element operable to transmit said driving radiation from outside said container to inside said container, and an outlet radiation transmitting element operable to transmit at least some of said plasma emitted radiation from inside said container to outside said container as output radiation; wherein at least one of said inlet and outlet radiation transmitting elements comprises a plane parallel plate.

Abstract: Method of manufacturing electronic devices using a maskless lithographic exposure system using a maskless pattern writer. The method comprises generating beamlet control data for controlling the maskless pattern writer to expose a wafer for creation of the electronic devices, wherein the beamlet control data is generated based on a feature data set defining features selectable for individualizing the electronic devices, wherein exposure of the wafer according to the beamlet control data results in exposing a pattern having a different selection of the features from the feature data set for different subsets of the electronic devices.

Abstract: A method of measuring a position of an alignment target on a substrate using an optical system. The method includes measuring a sub-segmented target by illuminating the sub-segmented target with radiation and detecting radiation diffracted by the sub-segmented target using a detector system to obtain signals containing positional information of the one sub-segmented target. The sub-segmented target has structures arranged periodically in at least a first direction, at least some of the structures including smaller sub-structures, and each sub-segmented target is formed with a positional offset between the structures and the sub-structures that is a combination of both known and unknown components. The signals, together with information on differences between known offsets of the sub-segmented target are used to calculate a measured position of an alignment target which is corrected for the unknown component of the positional offset.

Abstract: Disclosed is an illumination system for a metrology apparatus and a metrology apparatus comprising such an illumination system. The illumination system comprises an illumination source; and a linear variable filter arrangement configured to filter a radiation beam from said illumination source and comprising one or more linear variable filters. The illumination system is operable to enable selective control of a wavelength characteristic of the radiation beam subsequent to it being filtered by the linear variable filter arrangement.

Abstract: An immersion lithographic apparatus having a fluid handling structure, the fluid handling structure configured to confine immersion fluid to a region and including: a meniscus controlling feature having an extractor exit on a surface of the fluid handling structure; and a gas knife system outwards of the extractor exit and including passages each having an exit, the passages having a plurality of first passages having a plurality of corresponding first exits on the surface, and a plurality of second passages having a plurality of corresponding second exits outwards of the first exits on the surface, wherein the surface faces and is substantially parallel to a top surface of a substrate during exposure, and the first exits and the second exits are arranged at a greater distance from the substrate than the extractor exit.

Abstract: A method to improve a lithographic process of imaging a portion of a design layout onto a substrate using a lithographic apparatus, the method including: computing a multi-variable cost function, the multi-variable cost function being a function a plurality of design variables that represent characteristics of the lithographic process; and reconfiguring one or more of the characteristics of the lithographic process by adjusting one or more of the design variables until a certain termination condition is satisfied; wherein a bandwidth of a radiation source of the lithographic apparatus is allowed to change during the reconfiguration.

Abstract: A lithographic apparatus comprising a projection system configured to project a patterned radiation beam to form an exposure area on a substrate held on a substrate table, the lithographic apparatus further comprising a cooling apparatus (40) for cooling the substrate, wherein the cooling apparatus comprises a cooling element (42, 44) located above the substrate table and adjacent to the exposure area, the cooling element being configured to remove heat from the substrate.

Abstract: A resist composition is disclosed which comprises a perovskite material with a structure having a chemical formula selected from ABX3, A2BX4, or ABX4, wherein A is a compound containing an NH3 group, B is a metal and X is a halide constituent. The perovskite material may comprise one or more of the following components: halogen-mixed perovskite material; metal-mixed perovskite material, and organic ligand mixed perovsikte material.

Abstract: A positioning system including: a first body; a second body; and an actuator arranged between the first body and the second body to position the first body relative to the second body, wherein the actuator includes a first piezoelectric actuator and a second piezoelectric actuator arranged in series, wherein the first piezoelectric actuator has a first hysteresis, wherein the second piezoelectric actuator has a second hysteresis smaller than the first hysteresis, and wherein the second piezoelectric actuator has a positioning range at least equal to the first hysteresis.

Abstract: Disclosed is a method of measuring a parameter of a lithographic process, and associated inspection apparatus. The method comprises measuring at least two target structures on a substrate using a plurality of different illumination conditions, the target structures having deliberate overlay biases; to obtain for each target structure an asymmetry measurement representing an overall asymmetry that includes contributions due to (i) the deliberate overlay biases, (ii) an overlay error during forming of the target structure and (iii) any feature asymmetry. A regression analysis is performed on the asymmetry measurement data by fitting a linear regression model to a planar representation of asymmetry measurements for one target structure against asymmetry measurements for another target structure, the linear regression model not necessarily being fitted through an origin of the planar representation. The overlay error can then be determined from a gradient described by the linear regression model.

Abstract: In a lithographic process, product units such as semiconductor wafers are subjected to lithographic patterning operations and chemical and physical processing operations. Alignment data or other measurements are made at stages during the performance of the process to obtain object data representing positional deviation or other parameters measured at points spatially distributed across each unit. This object data is used to obtain diagnostic information by performing a multivariate analysis to decompose a set of vectors representing the units in the multidimensional space into one or more component vectors. Diagnostic information about the industrial process is extracted using the component vectors. The performance of the industrial process for subsequent product units can be controlled based on the extracted diagnostic information.

Abstract: Measurement data is obtained for calibration fields that have been exposed by a lithographic apparatus using different field layouts and exposure sequences. The measurement data is classified in subsets by scan direction, step direction, field size and other variables. The measurement data is indexed by a time value that varies through each exposure sequence. Time values within different exposure sequences can be related using a normalized time value based on the beginning and end of each exposure sequence. An inter-field performance model is calculated for each subset. An intra-field component of a performance model is calculated with time as a third dimension. The time-indexed performance model is used to determine intra-field corrections for a variety of product exposures having product layouts and product exposure sequences different to the calibration fields, based on time and other a variables of the product layout and product exposure sequence.

Abstract: A method for improving a lithographic process for imaging a portion of a design layout onto a substrate using a lithographic apparatus, the method including: obtaining a first source of the lithographic apparatus; classifying the first source into a class among a plurality of possible classes, based on one or more numerical characteristics of the first source, using a machine learning model, by a computer; determining whether the class is among one or more predetermined classes; only when the class is among the one or more predetermined classes, adjusting one or more source design variables to obtain a second source.

Abstract: A lithographic apparatus includes a base frame, an illumination system configured to condition a radiation beam and supported by the base frame, a support constructed to support a patterning device, the patterning device being capable of imparting the radiation beam with a pattern in its cross-section to form a patterned radiation beam, a substrate table constructed to hold a substrate, a projection system configured to project the patterned radiation beam onto a target portion of the substrate, a positioning device configured to position the substrate table, the positioning device being supported by the base frame, a sensor configured to sense a vibration caused by a torque exerted on the base frame, and an actuator configured to exert a force on the illumination system or the base frame, in response to the sensed vibration, in order to at least partly dampen the vibration.

Abstract: A method of forming at least one lithography feature, the method including: providing at least one lithography recess on a substrate, the or each lithography recess having at least one side-wall and a base, with the at least one side-wall having a width between portions thereof; providing a self-assemblable block copolymer having first and second blocks in the or each lithography recess; causing the self-assemblable block copolymer to self-assemble into an ordered layer within the or each lithography recess, the ordered layer including at least a first domain of first blocks and a second domain of second blocks; causing the self-assemblable block copolymer to cross-link in a directional manner; and selectively removing the first domain to form lithography features of the second domain within the or each lithography recess.

Abstract: A method for calculating electromagnetic scattering properties of a finite periodic structure having a direction of periodicity is disclosed. The method numerically calculates electromagnetic scattering properties using spatial discretization in the direction of periodicity and numerically calculates electromagnetic scattering properties using spectral discretization in a direction orthogonal to the direction of periodicity.

Abstract: Disclosed is a method of measuring a target, an associated substrate, a metrology apparatus and a lithographic apparatus. In one arrangement the target comprises a layered structure. The layered structure has a first target structure in a first layer and a second target structure in a second layer. The method comprises illuminating the target with measurement radiation. Scattered radiation formed by interference between plural predetermined diffraction orders is detected. The predetermined diffraction orders are generated by diffraction of the measurement radiation from the first target structure and are subsequently diffracted from the second target structure. A characteristic of the lithographic process is calculated using the detected scattered radiation formed by the interference between the predetermined diffraction orders.

Abstract: A lithographic apparatus includes a substrate table, a post-exposure handling module, a substrate handling robot and a drying station. The substrate table is configured to support a substrate for an exposure process. The post-exposure handling module is configured to handle the substrate post-exposure. The substrate handling robot is configured to transfer the substrate from the substrate table along a substrate unloading path into the post-exposure handling module. The drying station is configured to actively remove liquid from a surface of the substrate. The drying station is located in the substrate unloading path. The drying station is located in the post-exposure handling module. The post-exposure handling module may be a substrate handler.

Abstract: A method, system and program for determining a fingerprint of a parameter. The method includes determining a contribution from a device out of a plurality of devices to a fingerprint of a parameter. The method including: obtaining parameter data and usage data, wherein the parameter data is based on measurements for multiple substrates having been processed by the plurality of devices, and the usage data indicates which of the devices out of the plurality of the devices were used in the processing of each substrate; and determining the contribution using the usage data and parameter data.