Patents Assigned to NetShape Technologies, Inc.
  • SINTERED COPPER-BASED MATERIAL HAVING INCREASED GRAIN SIZE AND METHOD OF MAKING THE SAME
    Publication number: 20100190024
    Abstract: Disclosed are sintered copper-based materials and methods for forming the same having a larger grain size than materials formed through conventional methods. A metal powder having copper is compressed, pre-heated, and then sintered. Then, the density of the once sintered copper-based material is sized to increase density and subjected to a second sintering act. The sintered copper-based materials have a grain size of at least 50 ?m.
    Type: Application
    Filed: January 26, 2010
    Publication date: July 29, 2010
    Applicant: NetShape Technologies, Inc
    Inventors: William L. Edwards, JR., David L. Freeman, JR.
  • Tool rig for the compaction of particulate material
    Patent number: 7390183
    Abstract: A tool rig for the compaction of particulate materials includes a base and a cylinder block disposed on the base. At least two pistons are disposed within the cylinder block and one piston is at least partially disposed within one other piston. A supply component is disposed in the inner diameter of at least one of the pistons and defines at least one channel. The channel connects an energy supply to at least one of the pistons.
    Type: Grant
    Filed: January 13, 2003
    Date of Patent: June 24, 2008
    Assignee: NetShape Technologies, Inc.
    Inventor: Gerd Hinzmann