Abstract: An electric heating device (20) is described which has at least one first electrically conductive component (21), at least one heating layer (22) and at least one second electrically conductive component (23). According to the invention, it is envisaged that the first electrically conductive component (21) and/or the second electrically conductive component (23) is/are produced and/or arranged on the heating layer (22) by means of a thermal spraying process. Alternatively or additionally, according to the invention, it is envisaged that the electrically conductive components (21, 23) and the heating layer (22) are arranged with respect to one another in such a way that a current flow perpendicularly to the plane of the heating layer (22) and/or in the direction of the plane of the heating layer (22) is realized or can be realized. In order to produce an assembly (10), such a heating device (20) can preferably be arranged on a substrate element (11). Furthermore, a suitable production method is described.

Abstract: A method for producing or disassembling an electronic assembly are provided. The assembly may have a heating device integrated into a substrate. The heating device can be heated via an external power supply during the assembly process so that, for example, solder connections of an electric component can be melted. The heating device can also be used when operating the electronic assembly, and the heating device can then be directly actuated by the component. For this purpose, an electric connection is then established between the component and the heating device, the connection not yet being provided during the thermal assembly process in order to protect the electronic components of the circuit from being damaged.