Abstract: The method of the preferred embodiments includes the steps of providing a base having a frame portion and a center portion; building a preliminary structure coupled to the base; removing a portion of the preliminary structure to define a series of devices and a plurality of bridges; removing the center portion of the base such that the frame portion defines an open region, wherein the plurality of bridges suspend the series of devices in the open region defined by the frame; and encapsulating the series of devices. The method is preferably designed for the manufacture of semiconductor devices, and more specifically for the manufacture of encapsulated implantable electrodes. The method, however, may be alternatively used in any suitable environment and for any suitable reason.

Abstract: The method of the preferred embodiments includes the steps of providing a base having a frame portion and a center portion; building a preliminary structure coupled to the base; removing a portion of the preliminary structure to define a series of devices and a plurality of bridges; removing the center portion of the base such that the frame portion defines an open region, wherein the plurality of bridges suspend the series of devices in the open region defined by the frame; and encapsulating the series of devices. The method is preferably designed for the manufacture of semiconductor devices, and more specifically for the manufacture of encapsulated implantable electrodes. The method, however, may be alternatively used in any suitable environment and for any suitable reason.

Abstract: The method of the preferred embodiments includes the steps of providing a base having a frame portion and a center portion; building a preliminary structure coupled to the base; removing a portion of the preliminary structure to define a series of devices and a plurality of bridges; removing the center portion of the base such that the frame portion defines an open region, wherein the plurality of bridges suspend the series of devices in the open region defined by the frame; and encapsulating the series of devices. The method is preferably designed for the manufacture of semiconductor devices, and more specifically for the manufacture of encapsulated implantable electrodes. The method, however, may be alternatively used in any suitable environment and for any suitable reason.

Abstract: The electrode lead system of a preferred embodiment includes a series of first electrical subsystems; a guiding element that positions the series of first electrical subsystems in a three dimensional arrangement within body tissue; a second electrical subsystem; and at least one connector that couples the first electrical subsystems to the second electrical subsystem. The electrode lead system of another preferred embodiment includes a series of electrode arrays; a guide tube that facilitates implantation of electrode arrays within body tissue and temporarily contains the series of electrode arrays; and a guiding element that provides a bias on the series of electrode arrays such that (a) when contained by the guide tube, the first electrical subsystems maintain a substantially singular path within body tissue, and (b) when not contained by the guide tube, the first electrical subsystems diverge along more than one path into a three dimensional arrangement within body tissue.

Abstract: A test system for medical devices that does not require physical contact with an electrical site along a conductive path is described. Not having to physical contact an electrical site while performing an electrical continuity test avoids potential damage to the site. The test system includes a fluidic channel that dispenses an electrolytic solution onto a first electrical site on the conductive path. A light source irradiates the first site to thereby induce a photoelectrochemical (PEC) effect at an interface thereof. The PEC effect produces a change in both the potential (i.e., voltage) and current carrying ability in the conductive path. That voltage or current is measured at a second site to determine whether there is electrical continuity or discontinuity between the sites on the conductive path.

Abstract: The implantable electrode system of the preferred embodiments includes a conductor, an interconnect coupled to the conductor, an insulator that insulates the interconnect, and an anchor that is connected to both the conductor and the insulating element. The anchor is mechanically interlocked with at least one of the conductor and the insulator.

Abstract: An improved deformable carrier or connector for an implantable neural interface device is described. The neural interface device comprises a carrier supporting at least one electrode array. The carrier comprises a tubular sidewall extending from a proximal carrier portion to a distal carrier portion. At least one deformable segment is provided in the carrier sidewall. The deformable segment is more pliable than the remainder of the carrier sidewall to preferably move in response to forces imparted on the carrier and the electrode array by the shifting forces in body tissue. The deformable segment takes the form of a thinned sidewall segment or a slitted wall segment.

Abstract: An improved deformable carrier or connector for an implantable neural interface device is described. The neural interface device comprises a carrier supporting at least one electrode array. The carrier comprises a tubular sidewall extending from a proximal carrier portion to a distal carrier portion. At least one deformable segment is provided in the carrier sidewall.. The deformable segment is more pliable than the remainder of the carrier sidewall to preferably move in response to forces imparted on the carrier and the electrode array by the shifting forces in body tissue. The deformable segment takes the form of a thinned sidewall segment or a slitted wall segment.

Abstract: The implantable electrode system of the preferred embodiments includes a conductor, an interconnect coupled to the conductor, an insulator that insulates the interconnect, and an anchor that is connected to both the conductor and the insulating element. The anchor is mechanically interlocked with at least one of the conductor and the insulator.

Abstract: One embodiment of the invention includes an implantable electrode lead system that includes a series of shims stacked upon each other, a series of first components, and a series of second components connected to the series of first components through a series of connectors. One of the first components extends from one of the shims, and another of the first components extends from another one of the shims. The shims position the first components in a three dimensional arrangement.

Abstract: Improved low-cost, highly reliable methods for increasing the electrochemical surface area of neural electrodes are described. A mono-layer of polymeric nanospheres is first deposited on a metallization supported on a dielectric substrate. The nanospheres self-assemble into generally repeating lattice forms with interstitial space between them. Then, the geometric surface area of the metallization material is increased by either selectively etching part-way into its depth at the interstitial space between adjacent nanospheres. Another technique is to deposit addition metallization material into the interstitial space. The result is undulation surface features provided on the exposed surface of the metallization. This helps improve the electrochemical surface area when the treated metallizations are fabricated into electrodes.

Abstract: A neural interface system including an electrode array and a carrier that supports the electrode array, in which the electrode array includes a substrate rolled into a three-dimensional shape, a plurality of conductive traces patterned on the substrate and adapted to transmit electrical signals, and a plurality of elliptically shaped, externally facing electrode sites coupled to the plurality of conductive traces that electrically communicate with their surroundings. The plurality of electrodes are arranged in a triangular lattice circumferentially around and axially along the carrier, and the substrate includes an edge that extends axially along the carrier and is constrained between a first axial row portion of the plurality of electrode sites and a second axial row portion of the plurality of electrode sites adjacent to the first axial row portion.

Abstract: The method of the preferred embodiments includes the steps of providing a base having a frame portion and a center portion; building a preliminary structure coupled to the base; removing a portion of the preliminary structure to define a series of devices and a plurality of bridges; removing the center portion of the base such that the frame portion defines an open region, wherein the plurality of bridges suspend the series of devices in the open region defined by the frame; and encapsulating the series of devices. The method is preferably designed for the manufacture of semiconductor devices, and more specifically for the manufacture of encapsulated implantable electrodes. The method, however, may be alternatively used in any suitable environment and for any suitable reason.

Abstract: The method of the preferred embodiments includes the steps of providing a base having a frame portion and a center portion; building a preliminary structure coupled to the base; removing a portion of the preliminary structure to define a series of devices and a plurality of bridges; removing the center portion of the base such that the frame portion defines an open region, wherein the plurality of bridges suspend the series of devices in the open region defined by the frame; and encapsulating the series of devices. The method is preferably designed for the manufacture of semiconductor devices, and more specifically for the manufacture of encapsulated implantable electrodes. The method, however, may be alternatively used in any suitable environment and for any suitable reason.

Abstract: The present invention relates to a medical device (2) for electrical stimulation. The device comprising an implantable elongated lead system (20) having a distal end (21) and a proximal end (22), the lead system comprises one or more electrical conductors (23) for connection to one or more electrodes (24). The one or more electrical conductors are wound along a length axis (25) of the lead system with a plurality of windings, and wherein the density of windings is non-uniformly distributed along the length axis. In an embodiment, the medical device is in the form of a deep brain stimulation (DBS) device.

Abstract: The implantable device system of the preferred embodiments includes a guide tube, a first electrical subsystem, and a second electrical subsystem. The first electrical subsystem is connected to the second electrical subsystem. The guide tube functions to facilitate the insertion of at least one first electrical subsystem and is adapted to allow the first electrical subsystem(s) to move freely with the tissue, allowing the placement of the first electrical subsystem without disconnecting the second electrical subsystem. The implantable device system may be implanted into the brain, spinal cord, peripheral nerve, muscle, or any other suitable anatomical location. The guide tube of the system, however, may be alternatively used in any suitable environment and for any suitable reason.