Patents Assigned to Nevin Electric Limited
  • Method of plating solder onto printed circuit boards
    Patent number: 4304640
    Abstract: In a method of electro-plating solder onto selected areas of the conductors of a printed circuit board, the following steps are followed: a continuous conductive surface is formed on a board carrying circuit conductors, a mask is formed on the surface to leave predetermined exposed areas, solder is electroplated on the said areas, and the mask and the remaining conductive surface are removed. The method is suitable for the plating of through holes in the board to connect conductors on the two sides of the board.
    Type: Grant
    Filed: January 21, 1980
    Date of Patent: December 8, 1981
    Assignee: Nevin Electric Limited
    Inventor: John B. Walker