Patents Assigned to New H3C Technologies Co., Lid.
  • Patent number: 11012258
    Abstract: An egress VTEP device of a data center receives a first packet sent by a local VTEP device of the data center, through an intra-domain VXLAN tunnel, and sends the first packet to an egress VTEP device on an opposite end of another data center through a corresponding inter-domain VXLAN tunnel. In addition, the egress VTEP device of the data center receives a second packet sent by the egress VTEP devices on an opposite end of another data center, through an inter-domain VXLAN tunnel, and sends the second packet to a local VTEP device of the data center through a corresponding intra-domain VXLAN tunnel.
    Type: Grant
    Filed: April 28, 2017
    Date of Patent: May 18, 2021
    Assignee: New H3C Technologies Co., Lid.
    Inventor: Jianfeng Liu