Abstract: A system is described that combines an optical spectrometer and a particle analysis spectrometer for simultaneous and/or sequential analysis of a sample placed in a sample chamber. A laser resonator generates a light beam on the sample in the sample chamber to produce a plasma formation and an aerosol formation. The optical spectrometer (spectrophotometer) analyzes a plasma formation generated from the sample surface of the sample, qualifies and/or quantifies and records chemical data of the sample. The particle analysis spectrometer analyzes an aerosol formation generated from the sample in the sample chamber, and qualifies and/or quantifies and records data of the sample. The combination of the optical spectrometer and the particle analysis spectrometer in the system enables simultaneous and/or sequential analysis, qualification and/or quantification, and recording of the chemical and physical data derived from the transfer of laser energy into a solid, liquid or gas.

Abstract: A method and system for cutting a wafer comprising a semiconductor substrate attached to an array of integrated devices includes placing the wafer on a stage such as a movable X-Y stage including a vacuum chuck having a porous mounting surface, and securing the wafer during and after cutting by vacuum pressure through the pores. The wafer is cut by directing UV pulses of laser energy at the substrate using a solid-state laser having controlled polarization. An adhesive membrane can be attached to the separated die to remove them from the mounting surface, or the die can otherwise be removed after cutting from the wafer.

Abstract: A method and system for cutting a wafer comprising a conductive substrate attached to an array of integrated devices includes placing the wafer on a stage such as a movable X-Y stage including a vacuum chuck having a porous mounting surface, and securing the wafer during and after cutting by vacuum pressure through the pores. The wafer is cut by directing UV pulses of laser energy at the conductive substrate using a solid-state laser. An adhesive membrane can be attached to the separated die to remove them from the mounting surface, or the die can otherwise be removed after cutting from the wafer.