Abstract: An apparatus for trapping residual product of semiconductor manufacturing processes increases trapping effect and trapping capacity of residual product of reaction by maximizing an effective area for the residual product of reaction to be trapped while actively preventing the residual product of reaction generated in a process chamber during a thin film deposition and etching process from sucking into a vacuum pump, thereby easily removing the trapped residual product of reaction, including hollow housing having an inner containing space, first connection pipe connecting process chamber and housing, second connection pipe connecting vacuum pump and housing, and a protrusion extending inwardly and protruding from a housing base, cooling element disposed inside the housing for cooling the residual product of reaction flowing into the housing through the first connection pipe, and trap plates disposed inside the housing as multiple layers on which the residual product of reaction is laminated.