Abstract: One embodiment of the present invention is a method for fabricating a structure useful for testing circuits that includes steps of: (a) aligning interconnectors with a Probe Card; (b) aligning a substrate with the interconnectors; and (c) connecting the interconnectors to the Probe Card and the substrate; wherein the interconnectors are electrical conductors that have at least a core that does not change shape as a result of applying heat during the step of connecting.

Abstract: One embodiment of the present invention is a structure useful for testing circuits that includes: (a) a substrate having contactors on a first side and pads on a second side; (b) a card having pads on a first side; (c) an interconnector that electrically connects the pads on the second side of the substrate with the pads on the card, the interconnector comprising a connector-holder comprised of electrical connectors having first and second retractable ends that are extendable out of a first and second side of the connector-holder, respectively, wherein the first retractable ends contact pads on the substrate, and the second retractable ends contact pads on the card; and (d) a clamp that is adapted to fit over the substrate and the connector-holder, the clamp having an opening to provide access to the contactors, and which clamp is connected to the card.

Abstract: One embodiment of the present invention is a structure useful for testing circuits that includes: (a) a flexible substrate having contactors on a first side and pads on a second side; (b) a rigid substrate having vias aligned with the pads on the second side of the flexible substrate; (c) an adhesive layer comprised of a compliant adhesive material having vias aligned with the pads on the second side of the flexible substrate; the adhesive layer being affixed to the flexible substrate and the rigid substrate; (d) a card; (e) electrical connectors that are retained in the vias of the rigid substrate and the adhesive layer, which electrical connectors have first and second retractable ends, wherein the first retractable ends contact pads on the substrate, and the second retractable ends contact pads on the card; and (f) a clamp that is adapted to fit over the substrate and the adhesive layer, the clamp having an opening to provide access to the contactors, wherein the clamp is connected to the card.

Abstract: One embodiment of the present invention is a structure useful for testing circuits that includes: (a) a substrate having contactors on a first side and pads on a second side; (b) a card having pads on a first side; and (c) interconnectors that electrically connect the pads on the second side of the substrate with the pads on the card; wherein at least one of the interconnectors includes at least a portion that does not melt at temperatures in a range from about 183° C. to about 230° C., and the distance between the substrate and the card is determined by a dimension of the at least a portion.

Abstract: One embodiment of the present invention is a method for fabricating a structure useful for testing circuits that includes steps of: (a) aligning a first side of a connector-holder comprised of electrical connectors having retractable ends that are extendable out of the first side of the connector-holder and having retractable ends that are extendable out of a second side of the connector-holder with a substrate; and (b) connecting ends extendable out of the first side to pads on the substrate to form the structure.

Abstract: One embodiment of the present invention is a structure useful for testing circuits that includes: (a) a Probe Card; (b) a substrate having contactors on a first side and pads on a second side, wherein a non-RF group of pads on the second side are used to test non-RF I/O of the circuit and an RF group of pads on the second side are used to test RF I/O of the circuit; and (c) an RF interface board having a non-RF group of pads and an RF group of the pads on a first side, and a non-RF group of pads and a group of RF coaxial cable connectors on a second side.