Patents Assigned to Nexcom International Co. Ltd.
  • Patent number: 6563708
    Abstract: An improved heat dissipating assembly for a server box body includes a box body and a sealing cover. A grid plate is transversely erected at the center of the box body. An upper end of one side of the grid plate is provided with a plurality of air-absorbing portions having fans therein. The other side of the grid plate has a plurality of main boards and heat dissipating plates insertably disposed thereon. The invention is characterized in that a suitable clearance is formed between a rear side of the grid plate of the box body and the partition plate, and a heat concentration area is also formed therebetween. The hot air from the main boards and the heat dissipating plates is discharged to the concentration area for drawing by the fans in the air-absorbing portions to the outside.
    Type: Grant
    Filed: October 15, 2002
    Date of Patent: May 13, 2003
    Assignee: NEXCOM International Co., Ltd.
    Inventors: Chen-Hao Chan, Hsiang-Chan Chen
  • Patent number: 6179664
    Abstract: A 64PCI-ISA edge connector has a standard ISA edge connector and a 64-bit PCI edge connector. The 64-bit PCI edge connector has a 32-bit PCI edge connector and a 64-bit edge connector extension. A gap between the 32-bit PCI edge connector and the 64-bit edge connector extension is made large enough to permit the entire 64PCI-ISA edge connector to plug into a 32PCI-ISA slot, providing 32-bit PCI-ISA functionality in a 32PCI-ISA slot, and 64-bit functionality in a 64PCI-ISA slot.
    Type: Grant
    Filed: February 18, 2000
    Date of Patent: January 30, 2001
    Assignee: Nexcom International Co. Ltd.
    Inventors: Huei-Guo Tung, Chun-Chun Liu
  • Patent number: 6066900
    Abstract: The present invention provides a computer system having a backplane with a plurality of subsystems which can be individually switched on or off. The computer system comprises a backplane having a plurality of power zones, a power control circuit installed in the backplane for each of the power zones for controlling electric power supplied to the power zone from a power supply, and a subsystem installed in each of the power zones, each of the subsystems comprising an I/O (input/output) bus, at least one I/O slot connected to the I/O bus for connecting an I/O device, and a processor connected to the I/O bus for controlling operations of the subsystem. Each of the subsystems can be switched on or off by using the power control circuit of the power zone of the subsystem.
    Type: Grant
    Filed: March 2, 1998
    Date of Patent: May 23, 2000
    Assignee: Nexcom International Co. Ltd.
    Inventors: Chen Hsiang Chan, Tung Huei-Guo, Kuo Hung-Yi