Patents Assigned to NEXFLEX CO., LTD.
  • Publication number: 20240262963
    Abstract: A polyimide composition, a method of preparing the polyimide composition, a polyimide film, and a flexible copper clad laminate are provided. The polyimide composition includes a dianhydride, and a diamine, and the diamine comprises an aromatic diamine, and an aliphatic diamine.
    Type: Application
    Filed: January 12, 2024
    Publication date: August 8, 2024
    Applicant: NexFlex Co., Ltd.
    Inventors: So Jeong KIM, Joo Young KIM, Hyuk Jun KIM
  • Publication number: 20240254286
    Abstract: A polyesterimide resin composition, a polyesterimide resin layer, a flexible metal foil laminate, and methods of preparing the polyesterimide resin composition, the polyesterimide resin layer, and the flexible metal foil laminate are provided. The polyesterimide resin composition includes a compound having a structural unit represented by Chemical Formula 1: In Chemical Formula 1, m and n are mole fractions, and “m+n=1” “0.2?m?0.8” and “0.2?n?0.8” are satisfied. Ar1 and Ar2 are the same as or different from each other and are each independently a tetravalent organic group having at least one aromatic ring. R1, R2, and R4 to R6 each independently include at least one of —H, —F, —CH3, —OCH3, —CF3, and —OCF3. R3 is an ester group and includes —COO— or —OOC—.
    Type: Application
    Filed: December 8, 2023
    Publication date: August 1, 2024
    Applicant: NexFlex Co., Ltd.
    Inventors: Hyuk Jun KIM, Dae Nyoun KIM, Yun Jeong JO, Ki Hoon KIM, Ra Mi LEE
  • Publication number: 20240218170
    Abstract: A polyimide resin composition, a polyimide-based adhesive composition, a polyimide adhesive film, and a flexible metal clad laminate film are provided. The polyimide resin composition may be derived from a polyimide precursor composition including an aliphatic acid anhydride and an amine including an aromatic diamine and a dimer diamine, and the aliphatic acid anhydride may include an aliphatic tetracarboxylic acid anhydride.
    Type: Application
    Filed: December 6, 2023
    Publication date: July 4, 2024
    Applicant: NexFlex Co., Ltd.
    Inventors: Se Jin KWON, Doo Hyeon KIM, Yu Jeong LEE, Sung Su KIM, Hyuk Jun KIM
  • Publication number: 20240191028
    Abstract: The present disclosure relates to a composition for manufacturing a polyimide film and a polyimide film for a flexible metal clad laminate manufactured using the same. According to an aspect of the present disclosure, there is provided a composition for manufacturing a polyimide film, the composition comprising: an aromatic dianhydride; a diamine; and a curing catalyst, wherein the curing catalyst includes one or more selected from the group consisting of an imidazole-based compound, a quinolone-based compound, and a quinoline-based compound.
    Type: Application
    Filed: April 13, 2022
    Publication date: June 13, 2024
    Applicant: NEXFLEX CO., LTD.
    Inventors: So Jeong KIM, Joo Young KIM, Hyuk Jun KIM
  • Patent number: 11965110
    Abstract: The present disclosure relates to a polyimide varnish composition for a flexible substrate and a polyimide film using the same, and a polyimide varnish composition for a flexible substrate according to the present disclosure may include an acid anhydride including 3,3?,4,4?-biphenyltetracarboxylic dianhydride (BPDA) and pyromellitic dianhydride (PMDA), and a diamine. The polyimide varnish composition according to the present disclosure has the advantage of being able to manufacture a polyimide film having heat resistance, high flexural properties, and high flexibility by increasing elongation while having a low coefficient of thermal expansion.
    Type: Grant
    Filed: December 27, 2021
    Date of Patent: April 23, 2024
    Assignee: NEXFLEX CO., LTD.
    Inventors: So Jeong Kim, Joo Young Kim, Hyuk Jun Kim
  • Publication number: 20220220337
    Abstract: The present disclosure relates to a polyimide varnish composition for a flexible substrate and a polyimide film using the same, and a polyimide varnish composition for a flexible substrate according to the present disclosure may include an acid anhydride including 3,3?,4,4?-biphenyltetracarboxylic dianhydride (BPDA) and pyromellitic dianhydride (PMDA), and a diamine. The polyimide varnish composition according to the present disclosure has the advantage of being able to manufacture a polyimide film having heat resistance, high flexural properties, and high flexibility by increasing elongation while having a low coefficient of thermal expansion.
    Type: Application
    Filed: December 27, 2021
    Publication date: July 14, 2022
    Applicant: NexFlex Co., Ltd.
    Inventors: So Jeong KIM, Joo Young KIM, Hyuk Jun KIM
  • Publication number: 20220135836
    Abstract: The present disclosure relates to a polyimide film for a flexible metal clad laminate and a flexible metal clad laminate including the same, and an aspect of the present disclosure is to provide a polyimide film for a flexible metal clad laminate, which is derived from a polyimide precursor composition including an acid dianhydride and a diamine, in which the acid dianhydride includes 70% by mol or more of pyromellitic dianhydride (PMDA), and the diamine includes m-tolidine and dimer diamine.
    Type: Application
    Filed: October 25, 2021
    Publication date: May 5, 2022
    Applicant: NEXFLEX CO.,LTD.
    Inventors: Dae Nyoun KIM, Yun Jeong JO, Ra Mi LEE
  • Patent number: 10645805
    Abstract: Provided are a multi-layer flexible metal-clad laminate, and a manufacturing method thereof, and more particularly, a multi-layer flexible metal-clad laminate in which at the time of manufacturing a multi-layer polyimide film on a surface of a metal-clad having a predetermined surface roughness value (Rz, Ra) and having roughening particles having a predetermined size or less attached thereon, a multi-coating scheme is used to form each polyimide mixed layer, such that a light reflection on a surface of the polyimide film and a light reflection generated at an interlayer interface of the polyimide in the multi-layer polyimide film are decreased to have an improved light transmittance of a polyimide laminate film after the metal-clad is removed, and a manufacturing method thereof.
    Type: Grant
    Filed: December 19, 2013
    Date of Patent: May 5, 2020
    Assignee: NEXFLEX CO., LTD.
    Inventors: Ho Sub Kim, Byoung Wook Jo, Young Do Kim, Weon Jung Choi, Dae Nyoun Kim, Seung Jeong Kook