Abstract: A polyimide composition, a method of preparing the polyimide composition, a polyimide film, and a flexible copper clad laminate are provided. The polyimide composition includes a dianhydride, and a diamine, and the diamine comprises an aromatic diamine, and an aliphatic diamine.
Type:
Application
Filed:
January 12, 2024
Publication date:
August 8, 2024
Applicant:
NexFlex Co., Ltd.
Inventors:
So Jeong KIM, Joo Young KIM, Hyuk Jun KIM
Abstract: A polyesterimide resin composition, a polyesterimide resin layer, a flexible metal foil laminate, and methods of preparing the polyesterimide resin composition, the polyesterimide resin layer, and the flexible metal foil laminate are provided. The polyesterimide resin composition includes a compound having a structural unit represented by Chemical Formula 1: In Chemical Formula 1, m and n are mole fractions, and “m+n=1” “0.2?m?0.8” and “0.2?n?0.8” are satisfied. Ar1 and Ar2 are the same as or different from each other and are each independently a tetravalent organic group having at least one aromatic ring. R1, R2, and R4 to R6 each independently include at least one of —H, —F, —CH3, —OCH3, —CF3, and —OCF3. R3 is an ester group and includes —COO— or —OOC—.
Type:
Application
Filed:
December 8, 2023
Publication date:
August 1, 2024
Applicant:
NexFlex Co., Ltd.
Inventors:
Hyuk Jun KIM, Dae Nyoun KIM, Yun Jeong JO, Ki Hoon KIM, Ra Mi LEE
Abstract: A polyimide resin composition, a polyimide-based adhesive composition, a polyimide adhesive film, and a flexible metal clad laminate film are provided. The polyimide resin composition may be derived from a polyimide precursor composition including an aliphatic acid anhydride and an amine including an aromatic diamine and a dimer diamine, and the aliphatic acid anhydride may include an aliphatic tetracarboxylic acid anhydride.
Type:
Application
Filed:
December 6, 2023
Publication date:
July 4, 2024
Applicant:
NexFlex Co., Ltd.
Inventors:
Se Jin KWON, Doo Hyeon KIM, Yu Jeong LEE, Sung Su KIM, Hyuk Jun KIM
Abstract: The present disclosure relates to a composition for manufacturing a polyimide film and a polyimide film for a flexible metal clad laminate manufactured using the same. According to an aspect of the present disclosure, there is provided a composition for manufacturing a polyimide film, the composition comprising: an aromatic dianhydride; a diamine; and a curing catalyst, wherein the curing catalyst includes one or more selected from the group consisting of an imidazole-based compound, a quinolone-based compound, and a quinoline-based compound.
Type:
Application
Filed:
April 13, 2022
Publication date:
June 13, 2024
Applicant:
NEXFLEX CO., LTD.
Inventors:
So Jeong KIM, Joo Young KIM, Hyuk Jun KIM
Abstract: The present disclosure relates to a polyimide varnish composition for a flexible substrate and a polyimide film using the same, and a polyimide varnish composition for a flexible substrate according to the present disclosure may include an acid anhydride including 3,3?,4,4?-biphenyltetracarboxylic dianhydride (BPDA) and pyromellitic dianhydride (PMDA), and a diamine. The polyimide varnish composition according to the present disclosure has the advantage of being able to manufacture a polyimide film having heat resistance, high flexural properties, and high flexibility by increasing elongation while having a low coefficient of thermal expansion.
Type:
Grant
Filed:
December 27, 2021
Date of Patent:
April 23, 2024
Assignee:
NEXFLEX CO., LTD.
Inventors:
So Jeong Kim, Joo Young Kim, Hyuk Jun Kim
Abstract: The present disclosure relates to a polyimide varnish composition for a flexible substrate and a polyimide film using the same, and a polyimide varnish composition for a flexible substrate according to the present disclosure may include an acid anhydride including 3,3?,4,4?-biphenyltetracarboxylic dianhydride (BPDA) and pyromellitic dianhydride (PMDA), and a diamine. The polyimide varnish composition according to the present disclosure has the advantage of being able to manufacture a polyimide film having heat resistance, high flexural properties, and high flexibility by increasing elongation while having a low coefficient of thermal expansion.
Type:
Application
Filed:
December 27, 2021
Publication date:
July 14, 2022
Applicant:
NexFlex Co., Ltd.
Inventors:
So Jeong KIM, Joo Young KIM, Hyuk Jun KIM
Abstract: The present disclosure relates to a polyimide film for a flexible metal clad laminate and a flexible metal clad laminate including the same, and an aspect of the present disclosure is to provide a polyimide film for a flexible metal clad laminate, which is derived from a polyimide precursor composition including an acid dianhydride and a diamine, in which the acid dianhydride includes 70% by mol or more of pyromellitic dianhydride (PMDA), and the diamine includes m-tolidine and dimer diamine.
Abstract: Provided are a multi-layer flexible metal-clad laminate, and a manufacturing method thereof, and more particularly, a multi-layer flexible metal-clad laminate in which at the time of manufacturing a multi-layer polyimide film on a surface of a metal-clad having a predetermined surface roughness value (Rz, Ra) and having roughening particles having a predetermined size or less attached thereon, a multi-coating scheme is used to form each polyimide mixed layer, such that a light reflection on a surface of the polyimide film and a light reflection generated at an interlayer interface of the polyimide in the multi-layer polyimide film are decreased to have an improved light transmittance of a polyimide laminate film after the metal-clad is removed, and a manufacturing method thereof.
Type:
Grant
Filed:
December 19, 2013
Date of Patent:
May 5, 2020
Assignee:
NEXFLEX CO., LTD.
Inventors:
Ho Sub Kim, Byoung Wook Jo, Young Do Kim, Weon Jung Choi, Dae Nyoun Kim, Seung Jeong Kook