Abstract: In one embodiment, a sensor system includes an active thermal sensor pixel matrix, a plurality of presence sensors, and an image acquisition controller. The pixel matrix includes a plurality of pixels arranged in a plurality of rows and a plurality of columns and a boundary defining a perimeter. The plurality of presence sensors is disposed at least partially within the boundary of the pixel matrix. The image acquisition controller is coupled to the pixel matrix and the plurality of presence sensors. The image acquisition controller is configured to: (i) receive signals from the presence sensors; (ii) identify, based on the signals, a scan region, wherein the scan region is a portion of the pixel matrix that is in contact with or adjacent to a specimen; and (iii) obtain image data only from pixels that are within the scan region for generating an image of the specimen.

Abstract: A multi-segment pixel matrix, a sensor or device, a system, and a method, for biometric sensing, are provided. Such a device or system includes a sensor comprising a pixel matrix having two or more pixel arrays as separate segments logically divided in the pixel matrix. The pixel matrix may include both thermal sensing pixels and capacitive sensing nodes. The device or system may include a plurality of application-specific intergrade circuits (ASICs) coupled to the sensor. Each ASIC is configured to capture image data of a biometric pattern measured by at least one pixel array. Each pixel array is independently driven and scanned by one or more of the plurality of the ASICs. The device or system further includes a microcontroller unit coupled to the plurality of ASICs and are used to process the image data and/or control operation of the system. Such a sensor can be a fingerprint sensor.

Abstract: In one embodiment, a sensor system includes an active thermal sensor pixel matrix, a plurality of presence sensors, and an image acquisition controller. The pixel matrix includes a plurality of pixels arranged in a plurality of rows and a plurality of columns and a boundary defining a perimeter. The plurality of presence sensors is disposed at least partially within the boundary of the pixel matrix. The image acquisition controller is coupled to the pixel matrix and the plurality of presence sensors. The image acquisition controller is configured to: (i) receive signals from the presence sensors; (ii) identify, based on the signals, a scan region, wherein the scan region is a portion of the pixel matrix that is in contact with or adjacent to a specimen; and (iii) obtain image data only from pixels that are within the scan region for generating an image of the specimen.

Abstract: A multi-segment pixel matrix, a sensor or device, a system, and a method, for biometric sensing, are provided. Such a device or system includes a sensor comprising a pixel matrix having two or more pixel arrays as separate segments logically divided in the pixel matrix. The pixel matrix may include both thermal sensing pixels and capacitive sensing nodes. The device or system may include a plurality of application-specific intergrade circuits (ASICs) coupled to the sensor. Each ASIC is configured to capture image data of a biometric pattern measured by at least one pixel array. Each pixel array is independently driven and scanned by one or more of the plurality of the ASICs. The device or system further includes a microcontroller unit coupled to the plurality of ASICs and are used to process the image data and/or control operation of the system. Such a sensor can be a fingerprint sensor.

Abstract: Systems and methods for manufacturing flexible electronics are described herein. Methods in accordance with embodiments of the present technology can include disposing electrical features, such as thin film circuits, on a first side of a glass substrate, applying a first protective material over the electronic features, and exposing a second side of the glass substrate to a chemical etching tank to thin the glass substrate to a predetermined thickness. The thinning process can remove cracks and other defects from the second side of the glass substrate and enhance the flexibility of the electronic assembly. A second protective material can be disposed on the second side of the thinned glass substrate to maintain the enhanced backside surface of the glass substrate. In some embodiments, the method also includes singulating the plurality of electronic features into individual electronic components by submerging the electronic assembly into a chemical etching tank.

Abstract: In one embodiment, a sensor system includes an active thermal sensor pixel matrix, a plurality of presence sensors, and an image acquisition controller. The pixel matrix includes a plurality of pixels arranged in a plurality of rows and a plurality of columns and a boundary defining a perimeter. The plurality of presence sensors is disposed at least partially within the boundary of the pixel matrix. The image acquisition controller is coupled to the pixel matrix and the plurality of presence sensors. The image acquisition controller is configured to: (i) receive signals from the presence sensors; (ii) identify, based on the signals, a scan region, wherein the scan region is a portion of the pixel matrix that is in contact with or adjacent to a specimen; and (iii) obtain image data only from pixels that are within the scan region for generating an image of the specimen.

Abstract: A multi-segment pixel matrix, a sensor or device, a system, and a method, for biometric sensing, are provided. Such a device or system includes a sensor comprising a pixel matrix having two or more pixel arrays as separate segments logically divided in the pixel matrix. The pixel matrix may include both thermal sensing pixels and capacitive sensing nodes. The device or system may include a plurality of application-specific intergrade circuits (ASICs) coupled to the sensor. Each ASIC is configured to capture image data of a biometric pattern measured by at least one pixel array. Each pixel array is independently driven and scanned by one or more of the plurality of the ASICs. The device or system further includes a microcontroller unit coupled to the plurality of ASICs and are used to process the image data and/or control operation of the system. Such a sensor can be a fingerprint sensor.

Abstract: Systems and methods for manufacturing flexible electronics are described herein. Methods in accordance with embodiments of the present technology can include disposing electrical features, such as thin film circuits, on a first side of a glass substrate, applying a first protective material over the electronic features, and exposing a second side of the glass substrate to a chemical etching tank to thin the glass substrate to a predetermined thickness. The thinning process can remove cracks and other defects from the second side of the glass substrate and enhance the flexibility of the electronic assembly. A second protective material can be disposed on the second side of the thinned glass substrate to maintain the enhanced backside surface of the glass substrate. In some embodiments, the method also includes singulating the plurality of electronic features into individual electronic components by submerging the electronic assembly into a chemical etching tank.

Abstract: Systems and methods for manufacturing flexible electronics are described herein. Methods in accordance with embodiments of the present technology can include disposing electrical features, such as thin film circuits, on a first side of a glass substrate, applying a first protective material over the electronic features, and exposing a second side of the glass substrate to a chemical etching tank to thin the glass substrate to a predetermined thickness. The thinning process can remove cracks and other defects from the second side of the glass substrate and enhance the flexibility of the electronic assembly. A second protective material can be disposed on the second side of the thinned glass substrate to maintain the enhanced backside surface of the glass substrate. In some embodiments, the method also includes singulating the plurality of electronic features into individual electronic components by submerging the electronic assembly into a chemical etching tank.

Abstract: A protective coating layer, an electronic device including such a protective coating layer, and the methods of making the same are provided. The electronic device includes a substrate, a thin film circuit layer disposed over the substrate, and a protective coating layer disposed over the thin film circuit layer. The protective coating layer includes a first coating and a second coating disposed over the first coating. Each coating has a cross-plane thermal conductivity in a direction normal to a respective coating surface equal to or higher than 0.5 W/(m*K). The first coating and the second coating have different crystal or amorphous structures, different crystalline orientations, different compositions, or a combination thereof to provide different nanoindentation hardness. The first coating has a hardness lower than that of the second coating.

Abstract: A fingerprint sensor device with built-in liveness detection capabilities includes: an area sensor disposed on a top surface of a substrate; a stiffener disposed below a bottom surface of the substrate; a printed circuit making electrical connection to the sensor disposed below the stiffener; and a light source and a photodetector. At least one of the light source and photodetector is disposed on the printed circuit below the area sensor. The stiffener includes at least one through-hole located with respect to the light source or photodetector to allow light from the light source to transmit through the stiffener towards a finger located on the area sensor or to allow light reflected from the finger to pass through the stiffener to the photodetector.

Abstract: A protective coating layer, an electronic device including such a protective coating layer, and the methods of making the same are provided. The electronic device includes a substrate, a thin film circuit layer disposed over the substrate, and a protective coating layer disposed over the thin film circuit layer. The protective coating layer includes a first coating and a second coating disposed over the first coating. Each coating has a cross-plane thermal conductivity in a direction normal to a respective coating surface equal to or higher than 0.5 W/(m*K). The first coating and the second coating have different crystal structures, or different crystalline orientations, or different compositions, or a combination thereof to provide different nanoindentation hardness. The first coating has a hardness lower than that of the second coating.

Abstract: Systems and methods for detecting replay attacks on a biometric-based authentication system are disclosed herein. In some embodiments, the method includes generating a command set causing a fingerprint sensor to sequentially conduct a scan of pixels in the fingerprint sensor, wherein the command set includes one or more replay attack detection commands causing the fingerprint sensor to capture replay attack detection data, sending the commands to the fingerprint sensor, receiving fingerprint data, and evaluating the fingerprint data for the replay attack detection data. In some embodiments, the one or more replay attack detection commands include repeating the scan of a selected row of pixels, providing insufficient bias to a selected row of pixels, and/or providing too much bias to a selected row of pixels. In some embodiments, the replay attack detection commands are randomly generated for each scan. Various other aspects of the technology are described herein.

Abstract: In one aspect, a sensor includes an image acquisition controller and a pixel array. The pixel array includes a first set of pixels electrically coupled to the controller and a second set of pixels electrically coupled to the controller. The sensor is configured to operate in a first mode and a second mode. When operating in the first mode, the controller is configured to acquire signals from only the first set of pixels for generating a low-resolution image. When operating in the second mode, the controller is configured to acquire signals from both the first set of pixels and the second set of pixels for generating a high-resolution image.

Abstract: In one aspect, a sensor includes an image acquisition controller and a pixel array. The pixel array includes a first set of pixels electrically coupled to the controller and a second set of pixels electrically coupled to the controller. The sensor is configured to operate in a first mode and a second mode. When operating in the first mode, the controller is configured to acquire signals from only the first set of pixels for generating a low-resolution image. When operating in the second mode, the controller is configured to acquire signals from both the first set of pixels and the second set of pixels for generating a high-resolution image.

Abstract: A fingerprint sensor device with built-in liveness detection capabilities includes: an area sensor disposed on a top surface of a substrate; a stiffener disposed below a bottom surface of the substrate; a printed circuit making electrical connection to the sensor disposed below the stiffener; and a light source and a photodetector. At least one of the light source and photodetector is disposed on the printed circuit below the area sensor. The stiffener includes at least one through-hole located with respect to the light source or photodetector to allow light from the light source to transmit through the stiffener towards a finger located on the area sensor or to allow light reflected from the finger to pass through the stiffener to the photodetector.

Abstract: A protective coating layer, an electronic device including such a protective coating layer, and the methods of making the same are provided. The electronic device includes a substrate, a thin film circuit layer disposed over the substrate, and a protective coating layer disposed over the thin film circuit layer. The protective coating layer includes a first coating and a second coating disposed over the first coating. Each coating has a cross-plane thermal conductivity in a direction normal to a respective coating surface equal to or higher than 0.5 W/(m*K). The first coating and the second coating have different crystal structures, or different crystalline orientations, or different compositions, or a combination thereof to provide different nanoindentation hardness. The first coating has a hardness lower than that of the second coating.

Abstract: A fingerprint sensor device with built-in liveness detection capabilities includes: an area sensor disposed on a top surface of a substrate; a stiffener disposed below a bottom surface of the substrate; a printed circuit making electrical connection to the sensor disposed below the stiffener; and a light source and a photodetector. At least one of the light source and photodetector is disposed on the printed circuit below the area sensor. The stiffener includes at least one through-hole located with respect to the light source or photodetector to allow light from the light source to transmit through the stiffener towards a finger located on the area sensor or to allow light reflected from the finger to pass through the stiffener to the photodetector.

Abstract: A prelam layer for use in forming a laminated card includes a flexible circuit substrate; a fingerprint sensor disposed on the flexible circuit substrate, the fingerprint sensor having upper and bottom surfaces, the bottom surface of the fingerprint sensor being disposed on the substrate, an active layer of the fingerprint sensor disposed towards the upper surface of the fingerprint sensor; a first integrated circuit chip disposed on the substrate and having at least one lead electrically connected to the flexible circuit substrate; and an adapter flexible circuit electrically bonded to the active layer of the fingerprint sensor. The integrated circuit chip is adapted to communicate with the fingerprint sensor through the adapter flexible circuit.

Abstract: A fingerprint sensing device includes a substrate; a plurality of pixels arranged in a grid of rows and columns, each pixel having an active thermal sensing element therein; a first metal layer forming first addressing lines for addressing the active thermal sensing elements; a second metal layer above the first metal layer and forming second addressing lines for addressing the active thermal sensing elements; an electrically conductive ESD protection layer; and an insulating layer disposed between the ESD protection layer and the active thermal sensing elements. The ESD protection layer is electrically connected to a bias potential. The ESD protection layer is disposed in a pattern such that it partially overlaps each pixel, the ESD protection layer at least partially overlapping the active thermal sensing element of each pixel.