Abstract: A prelam layer for use in forming a laminated card includes a flexible circuit substrate; a fingerprint sensor disposed on the flexible circuit substrate, the fingerprint sensor having upper and bottom surfaces, the bottom surface of the fingerprint sensor being disposed on the substrate, an active layer of the fingerprint sensor disposed towards the upper surface of the fingerprint sensor; a first integrated circuit chip disposed on the substrate and having at least one lead electrically connected to the flexible circuit substrate; and an adapter flexible circuit electrically bonded to the active layer of the fingerprint sensor. The integrated circuit chip is adapted to communicate with the fingerprint sensor through the adapter flexible circuit.

Abstract: A fingerprint sensing device includes a substrate; a plurality of pixels arranged in a grid of rows and columns, each pixel having an active thermal sensing element therein; a first metal layer forming first addressing lines for addressing the active thermal sensing elements; a second metal layer above the first metal layer and forming second addressing lines for addressing the active thermal sensing elements; an electrically conductive ESD protection layer; and an insulating layer disposed between the ESD protection layer and the active thermal sensing elements. The ESD protection layer is electrically connected to a bias potential. The ESD protection layer is disposed in a pattern such that it partially overlaps each pixel, the ESD protection layer at least partially overlapping the active thermal sensing element of each pixel.

Abstract: A prelam layer for use in forming a laminated card includes a flexible circuit substrate; a fingerprint sensor disposed on the flexible circuit substrate, the fingerprint sensor having upper and bottom surfaces, the bottom surface of the fingerprint sensor being disposed on the substrate, an active layer of the fingerprint sensor disposed towards the upper surface of the fingerprint sensor; a first integrated circuit chip disposed on the substrate and having at least one lead electrically connected to the flexible circuit substrate; and an adapter flexible circuit electrically bonded to the active layer of the fingerprint sensor. The integrated circuit chip is adapted to communicate with the fingerprint sensor through the adapter flexible circuit.

Abstract: A prelam layer for use in forming a laminated card includes a flexible circuit substrate; a fingerprint sensor disposed on the flexible circuit substrate, the fingerprint sensor having upper and bottom surfaces, the bottom surface of the fingerprint sensor being disposed on the substrate, an active layer of the fingerprint sensor disposed towards the upper surface of the fingerprint sensor; a first integrated circuit chip disposed on the substrate and having at least one lead electrically connected to the flexible circuit substrate; and an adapter flexible circuit electrically bonded to the active layer of the fingerprint sensor. The integrated circuit chip is adapted to communicate with the fingerprint sensor through the adapter flexible circuit.

Abstract: A sensor apparatus includes an array of active sensor elements arranged in columns and rows. Each sensor element is associated with a thin film access device disposed in a first current path through which an activation current is provided to activate the sensor element. Each sensor element is read through a respective second current path. The second current paths do not include the thin film access device of the first current path. As such, noise from the thin film access device is isolated from the second current paths.

Abstract: A decoder for sequentially enabling outputs in response to clock signal inputs is described including X number of logic stages corresponding to X number of outputs of the decoder. Each of the logic stages has a plurality of inputs, wherein each logic stage includes fewer than log2X inputs for receiving the clock signal inputs.

Abstract: A sensor apparatus includes an array of active sensor elements arranged in columns and rows. Each sensor element is associated with a thin film access device disposed in a first current path through which an activation current is provided to activate the sensor element. Each sensor element is read through a respective second current path. The second current paths do not include the thin film access device of the first current path. As such, noise from the thin film access device is isolated from the second current paths.

Abstract: A sensor apparatus includes an array of active sensor elements arranged in columns and rows. Each sensor element is associated with a thin film access device disposed in a first current path through which an activation current is provided to activate the sensor element. Each sensor element is read through a respective second current path. The second current paths do not include the thin film access device of the first current path. As such, noise from the thin film access device is isolated from the second current paths.