Patents Assigned to NEXT LEVEL VENTURES LLC
  • Patent number: 11744294
    Abstract: A vaping device packaging system includes a first tray for holding vaping device bodies, the first tray having a plurality of voids, the voids holding a portion of a vaping device body to be filled with a substance. The first tray and the vaping device bodies are covered by a first cover. A second tray for holding vaping device mouthpieces has a plurality of voids allowing the vaping device mouthpieces to be vertically aligned with the corresponding vaping device bodies of the first tray, each of the voids holding a portion of a vaping device mouthpiece to cap a corresponding vaping device body. The first tray is capable of being placed over a jig having a plurality of jig voids corresponding to the voids for holding the vaping device bodies.
    Type: Grant
    Filed: December 2, 2022
    Date of Patent: September 5, 2023
    Assignee: NEXT LEVEL VENTURES LLC
    Inventors: Alex Kwon, Steven Hwang, Alex Gordon, Audra Horridge