Patents Assigned to NEXT LEVEL VENTURES LLC
  • Patent number: 12532914
    Abstract: This disclosure relates generally to vaporizing devices and components of vaporizing devices, such as mouthpiece locking structures. In various aspects, a locking structure for a mouthpiece includes a circular body extending between a proximal end and a distal end, where an interior surface of the body defines a central lumen. The locking structures may also include a clamp disposed within the central lumen, where the clamp has an angled wall extending inwardly from a rim of the interior surface of the body towards the central lumen. The clamp may additionally include a notch within the angled wall, with the angled wall of the clamp (i) encircling a substantial entirety of a circumference of the body, (ii) defining a clamp lumen, (iii) having a thickness ranging from about 0.5 mm to about 0.7 mm, and (iv) having an angle or bias of from about 100° to about 110°.
    Type: Grant
    Filed: March 26, 2024
    Date of Patent: January 27, 2026
    Assignee: Next Level Ventures LLC
    Inventor: Yifeng Deng
  • Patent number: D1039211
    Type: Grant
    Filed: May 2, 2022
    Date of Patent: August 13, 2024
    Assignee: Next Level Ventures LLC
    Inventor: Steven Hwang
  • Patent number: D1041741
    Type: Grant
    Filed: September 13, 2022
    Date of Patent: September 10, 2024
    Assignee: Next Level Ventures LLC
    Inventors: Jin Cheng, Xiujin Qiu
  • Patent number: D1042948
    Type: Grant
    Filed: March 14, 2022
    Date of Patent: September 17, 2024
    Assignee: Next Level Ventures LLC
    Inventor: Steven Hwang
  • Patent number: D1049472
    Type: Grant
    Filed: March 23, 2022
    Date of Patent: October 29, 2024
    Assignee: Next Level Ventures LLC
    Inventor: Steven Hwang
  • Patent number: D1062041
    Type: Grant
    Filed: January 11, 2023
    Date of Patent: February 11, 2025
    Assignee: Next Level Ventures LLC
    Inventor: Steven Hwang
  • Patent number: D1064397
    Type: Grant
    Filed: January 11, 2023
    Date of Patent: February 25, 2025
    Assignee: Next Level Ventures LLC
    Inventor: Steven Hwang
  • Patent number: D1071323
    Type: Grant
    Filed: November 14, 2022
    Date of Patent: April 15, 2025
    Assignee: Next Level Ventures LLC
    Inventor: Steven Hwang
  • Patent number: D1094862
    Type: Grant
    Filed: January 23, 2023
    Date of Patent: September 23, 2025
    Assignee: Next Level Ventures LLC
    Inventor: Steven Hwang
  • Patent number: D1101255
    Type: Grant
    Filed: September 13, 2023
    Date of Patent: November 4, 2025
    Assignee: Next Level Ventures LLC
    Inventor: Alex Gordon
  • Patent number: D1109419
    Type: Grant
    Filed: November 27, 2023
    Date of Patent: January 13, 2026
    Assignee: Next Level Ventures LLC
    Inventor: Steven Hwang
  • Patent number: D1110595
    Type: Grant
    Filed: November 21, 2023
    Date of Patent: January 27, 2026
    Assignee: Next Level Ventures LLC
    Inventor: Steven Hwang
  • Patent number: D1115161
    Type: Grant
    Filed: November 21, 2023
    Date of Patent: February 24, 2026
    Assignee: Next Level Ventures LLC
    Inventor: Steven Hwang
  • Patent number: D1117977
    Type: Grant
    Filed: June 25, 2025
    Date of Patent: March 10, 2026
    Assignee: Next Level Ventures LLC
    Inventor: Alex Gordon
  • Patent number: D1120460
    Type: Grant
    Filed: December 20, 2022
    Date of Patent: March 24, 2026
    Assignee: Next Level Ventures LLC
    Inventor: Steven Hwang
  • Patent number: D1121230
    Type: Grant
    Filed: April 4, 2024
    Date of Patent: March 31, 2026
    Assignee: Next Level Ventures LLC
    Inventor: Steven Hwang
  • Patent number: D1123242
    Type: Grant
    Filed: April 1, 2024
    Date of Patent: April 21, 2026
    Assignee: Next Level Ventures LLC
    Inventor: Lock Man Yee
  • Patent number: D1126468
    Type: Grant
    Filed: July 27, 2023
    Date of Patent: May 12, 2026
    Assignee: Next Level Ventures LLC
    Inventor: Steven Hwang
  • Patent number: D1127278
    Type: Grant
    Filed: July 8, 2022
    Date of Patent: May 19, 2026
    Assignee: Next Level Ventures LLC
    Inventors: Steven Hwang, Jin Cheng
  • Patent number: D1127282
    Type: Grant
    Filed: April 10, 2024
    Date of Patent: May 19, 2026
    Assignee: Next Level Ventures LLC
    Inventor: Steven Hwang