Patents Assigned to NEXTINPUT INC.
  • Patent number: 10067567
    Abstract: A multi-dimensional track pad is described that acts as human-machine interface (HMI). Inputs to the HMI can be made not only using the tradition two-dimensional (X-Y) inputs of a track pad, but also a third dimension, force, and even a fourth dimension, time. Tactile or audible feedback to the inputs can be provided. Methods of using the HMI to control a system are described as well as a track pad system that utilizes the HMI in communication with a processor.
    Type: Grant
    Filed: May 30, 2014
    Date of Patent: September 4, 2018
    Assignees: JOYSON SAFETY SYSTEMS ACQUISTION LLC, NextInput, Inc.
    Inventors: David Andrews, Ian Campbell, Ryan Diestelhorst, Jason Carl Lisseman, Don Metzger
  • Patent number: 9902611
    Abstract: Described herein is a miniaturized and ruggedized wafer level MEMS force sensor composed of a base and a cap. The sensor employs multiple flexible membranes, a mechanical overload stop, a retaining wall, and piezoresistive strain gauges.
    Type: Grant
    Filed: January 13, 2015
    Date of Patent: February 27, 2018
    Assignee: NEXTINPUT, INC.
    Inventors: Amnon Brosh, Ryan Diestelhorst, Steven Nasiri
  • Patent number: 9493342
    Abstract: A composite wafer level MEMS force dies including a spacer coupled to a sensor is described herein. The sensor includes at least one flexible sensing element, such as a beam or diaphragm, which have one or more sensor elements formed thereon. Bonding pads connected to the sensor elements are placed on the outer periphery of the sensor. The spacer, which protects the flexible sensing element and the wire bonding pads, is bonded to the sensor. For the beam version, the bond is implemented at the outer edges of the die. For the diaphragm version, the bond is implemented in the center of the die. An interior gap between the spacer and the sensor allows the flexible sensing element to deflect. The gap can also be used to limit the amount of deflection of the flexible sensing element in order to provide overload protection.
    Type: Grant
    Filed: June 21, 2013
    Date of Patent: November 15, 2016
    Assignee: NextInput, Inc.
    Inventor: Amnon Brosh
  • Patent number: 9487388
    Abstract: Described herein are ruggedized wafer level MEMS force dies composed of a platform and a silicon sensor. The silicon sensor employs multiple flexible sensing elements containing Piezoresistive strain gages and wire bonds.
    Type: Grant
    Filed: June 21, 2013
    Date of Patent: November 8, 2016
    Assignee: NextInput, Inc.
    Inventor: Amnon Brosh
  • Patent number: 9032818
    Abstract: A microelectromechanical (“MEMS”) load sensor device for measuring a force applied by a human user is described herein. In one aspect, the load sensor device has a contact surface in communication with a touch surface which communicates forces originating on the touch surface to a deformable membrane, on which load sensor elements are arranged, such that the load sensor device produces a signal proportional to forces imparted by a human user along the touch surface. In another aspect, the load sensor device has an overload protection ring to protect the load sensor device from excessive forces. In another aspect, the load sensor device has embedded logic circuitry to allow a microcontroller to individually address load sensor devices organized into an array. In another aspect, the load sensor device has electrical and mechanical connectors such as solder bumps designed to minimize cost of final component manufacturing.
    Type: Grant
    Filed: July 3, 2013
    Date of Patent: May 19, 2015
    Assignee: NextInput, Inc.
    Inventors: Ian Campbell, Ryan Diestelhorst
  • Publication number: 20130096849
    Abstract: An interface device for measuring forces applied to the interface device. The interface device has a flexible contact surface suspended above a rigid substrate. The interface device has at least one sensor in communication with the contact surface. The interface device has processing circuitry for receiving signals from the sensors and substantially instantaneously producing an output signal corresponding to the location and force applied in multiple locations across the contact surface.
    Type: Application
    Filed: October 11, 2012
    Publication date: April 18, 2013
    Applicant: NEXTINPUT INC.
    Inventor: NextInput Inc.