Patents Assigned to Nextronics Engineering Corp.
  • Patent number: 7413449
    Abstract: An improved pluggable insulated terminal block includes a terminal block and a plurality of terminal-protecting pieces. The terminal block comprises a first cover, a second cover and a plurality of terminals. An inner wall of the first cover is provided with a plurality of first terminal holders. An inner wall of the second cover is provided with a plurality of second terminal holders. Each terminal penetrates through one of the first terminal holders and one of the second terminal holders. The first cover is connected with the second cover. The terminal-protecting pieces are provided between the first terminal holders and the second terminal holders. The terminal-protecting pieces are arranged on the terminals. The two ends of each terminal extend beyond the terminal-protecting piece. Via this arrangement, the terminals will not be pushed inside the terminal block, when the terminals are inserted into a circuit board.
    Type: Grant
    Filed: November 1, 2007
    Date of Patent: August 19, 2008
    Assignee: Nextronics Engineering Corp.
    Inventors: Hou-An Su, You-Hua Cai
  • Patent number: 7159283
    Abstract: A locking device for a panel is provided for a single board computer for fixing onto the chassis of an industrial personal computer. The locking device includes a handle, a locking element, a first spring, a seat and a second spring. The handle has a concave groove at the front-end thereof for receiving the locking element. The first spring is placed in an inner of the locking element for abutting against an inner portion of the handle. The pin penetrates through the seat and the handle and fixes them together. The second spring is mounted on the pin and has an end hooked to the locking element. The locking element has a pressing portion. When the pressing portion is pressed, the handle and the locking element move back together through the pin as an axis.
    Type: Grant
    Filed: September 15, 2004
    Date of Patent: January 9, 2007
    Assignee: Nextronics Engineering Corp.
    Inventors: Hao-Chun Chang, Hou-An Su, Hui-Chun Kuo
  • Patent number: 6755672
    Abstract: A protection cover integrally formed of plastic by molding ejection is provided. An elastic locking structure is disposed at two sides of the protection cover. An abutting portions having a ‘<’-shaped part and a ‘>’-shaped part is formed on the locking structure to abut against the outer edge wall of the connector so that the protection cover and the connector can be firmly connected together. Reinforcement portions are formed at the inner top face and the link positions at two inner sides of the protection cover.
    Type: Grant
    Filed: November 21, 2002
    Date of Patent: June 29, 2004
    Assignee: Nextronics Engineering Corp.
    Inventors: Shih Yung Lai, Lee Jen Wu, Chung Hao Chen, Chih Cheng Wang
  • Publication number: 20040102068
    Abstract: An improved connector protection cover integrally formed of plastic by molding ejection is provided. An elastic locking structure is disposed at two sides of the protection cover. An abutting portions having a ‘<’-shaped part and a ‘>’-shaped part is formed on the locking structure to abut against the outer edge wall of the connector so that the protection cover and the connector can be firmly connected together. It is not necessary to use a professional tool like a screwdriver to separate the protection cover from the connector. Scrapes on the surface of the connector can also be avoided. Moreover, reinforcement portions are formed at the inner top face and the link positions at two inner sides of the protection cover to prevent the protection cover from crushing terminals in the connector due to stacking of the connectors during transportation.
    Type: Application
    Filed: November 21, 2002
    Publication date: May 27, 2004
    Applicant: Nextronics Engineering Corp.
    Inventors: Shih-Yung Lai, Lee-Jen Wu, Chung-Hao Chen, Chih-Cheng Wang
  • Patent number: 6542369
    Abstract: This invention provides a combined base frame for supporting and fixing a CPU heat sink. The base frame has a left-side frame body and a right-side frame body. The buckling pieces are integrally formed under the base frame. The base frame can be efficiently mounted on a circuit board by the engagement between the left-side frame body and a right-side frame body. When an operator needs to install a CPU onto the circuit board, the base frame can be disassembled in a short time.
    Type: Grant
    Filed: December 27, 2001
    Date of Patent: April 1, 2003
    Assignee: Nextronics Engineering Corp.
    Inventor: Lee-Jen Wu
  • Patent number: 6419008
    Abstract: A CPU cooling device with a mounting mechanism has at least one pair of wedge members. The wedge member has a positioning end for passing through a through hole of a vertical plate, a protruding block, a snapping plate for retaining a fixing frame by means of engagement of a distal snapping end on the snapping plate and a flange of the fixing frame, and an embedding plate for locking a radiator by inserting the embedding plate into a groove on a ledge of the radiator.
    Type: Grant
    Filed: November 13, 2001
    Date of Patent: July 16, 2002
    Assignee: Nextronics Engineering Corp.
    Inventor: Lee-Jen Wu
  • Patent number: D562326
    Type: Grant
    Filed: January 23, 2006
    Date of Patent: February 19, 2008
    Assignee: Nextronics Engineering Corp.
    Inventor: Yang-Yuan Hsu
  • Patent number: D562327
    Type: Grant
    Filed: January 23, 2006
    Date of Patent: February 19, 2008
    Assignee: Nextronics Engineering Corp.
    Inventor: Yang-Yuan Hsu
  • Patent number: D568840
    Type: Grant
    Filed: July 14, 2005
    Date of Patent: May 13, 2008
    Assignee: Nextronics Engineering Corp.
    Inventor: Chi-Lin Hsu
  • Patent number: D580372
    Type: Grant
    Filed: May 5, 2005
    Date of Patent: November 11, 2008
    Assignee: Nextronics Engineering Corp.
    Inventor: Shih Yung Lai