Abstract: A substrate separation chuck adapted to separate a substrate from an adhering surface. The substrate separation chuck has a support adapted to support the adhering surface. An air bearing surface is adapted to support the substrate, the air bearing surface axially moveable relative to the support. The air bearing surface has a first position adjacent the substrate with the substrate coupled to the adhering surface. The air bearing surface is moveable from the first position to a second position separating the substrate from the adhering surface without contact between the substrate and the air bearing surface.

Abstract: A substrate chuck comprising a frame forming a support adapted to support an adhering surface thereon and a Bernoulli chuck surface coupled to the frame and adapted to support the substrate, the Bernoulli chuck surface being axially moveable relative to the support. The Bernoulli chuck surface has a first position adjacent the substrate with the substrate coupled to the adhering surface and wherein the Bernoulli chuck surface is moveable from the first position to a second position separating the substrate from the adhering surface without contact between the substrate and the Bernoulli chuck surface.

Abstract: A substrate loader adapted to load and unload a substrate to and from a moveable holder having a seal. The substrate loader has a base and a holder support frame coupled to the base, the holder support frame adapted to repeatably position the moveable holder relative to a predetermined datum. The substrate transport is coupled to the base and having a substrate chuck and adapted to move and transport the substrate relative to the holder. The substrate transport is deterministically positioned relative to the predetermined datum and is adapted to move the substrate from a first position, with the substrate captured by the moveable holder, to a second position with the substrate disengaged from the holder and the seal, the substrate transport movement of the substrate from the first to the second position effecting disengagement from the holder and the seal substantially without contacting the substrate.

Abstract: A rotary chuck adapted to hold a substrate. The rotary chuck has a rotatable chuck portion and an edge grip having a movable grip member movably mounted to the rotatable chuck portion, the moveable grip member being substantially free moving so that rotation of the rotating chuck portion causes the moveable grip member to move in a plane substantially aligned with a surface of the substrate to engage the substrate in a engaged position. A resilient element is coupled to the moveable grip member, the resilient member biasing the grip member to a disengaged position.

Abstract: A method of forming a metal feature on a workpiece with deposition is provided. The method includes providing an under bump metal layer for solder of an electronic device on the workpiece, depositing a substantially pure tin layer directly to the under bump metal layer, and depositing a tin silver alloy layer onto the substantially pure tin layer.

Abstract: A workpiece holder for fluid processing a workpiece including a transportable frame, a flexible member connected to the frame and defining at least one retaining feature, and a ring comprising at least one engagement feature engageable with the at least one retaining feature of the flexible member, wherein the flexible member is flexed to provide a force to the at least one engagement feature to cause the ring to form a barrier to fluid entry with the workpiece.

Abstract: A method of fluid sealing a workpiece is provided. The method includes providing a force to cause a ring to form a barrier to fluid entry with the workpiece and preventing fluid from crossing the barrier to fluid entry by forming a pressure differential across the barrier.

Abstract: A method of fluid sealing a workpiece is provided. The method includes placing a workpiece on a ring, engaging at least one engagement feature of the ring with at least one retaining feature defined by the member and flexing the member to provide a force to the at least one engagement feature to cause the ring to form a barrier to fluid entry with the workpiece.

Abstract: A method and system for coating the interior surfaces of microscale hole features fabricated into the substantially planar surface of a work piece. The method comprises providing a work piece with a barrier metal coating that is substantially continuous and uniform both along the planar surface of the work piece and the inner surfaces of the microscale hole features wherein said barrier metal coating is applied by a substantially surface reaction limited process. The workpiece is provided with a coating, on the planar surface of the work piece, of a thick metal layer anchored to the barrier metal coat and disposed to provide substantially uniform electrical conduction capability to the microscale features located throughout and across the workpiece. An electrical contact path is provided to the electrically conductive coating at the perimeter of the work piece.

Abstract: A method of fluid processing a semiconductor workpiece, including disposing a workpiece holder with a housing capable of containing a fluid, the workpiece holder retaining the workpiece, providing an agitation system connected to the housing and comprising a member disposed within the housing adjacent the workpiece holder, and agitating the fluid by moving the member substantially parallel to a surface of the workpiece with a non-uniform oscillatory motion, the non-uniform oscillatory motion being a series of substantially continuous geometrically asymmetric oscillations wherein each consecutive oscillation of the series is geometrically asymmetric having at least two substantially continuous opposing strokes wherein reversal positions of each substantially continuous stroke of the substantially continuous asymmetric oscillation are disposed asymmetrically with respect to a center point of each immediately preceding substantially continuous stroke of the oscillation.

Abstract: A substrate thermal processing system. The system has at least one substrate holding module having a housing configured for holding an isolated environment therein. A substrate heater is located in the housing and has a substrate heating surface. A substrate cooler is located in the housing and having a substrate cooling surface. A gas feed opening into the housing and feeding inert or reducing gas into the housing when the substrate is heated by the heating surface. A gas restrictor is within the housing restricting the fed gas between the substrate heating surface and a surrounding atmospheric region substantially surrounding the substrate heating surface in the housing and forming an aperture through which the fed gas communicates with the atmospheric region.

Abstract: In one exemplary embodiment, a substrate processing pallet is provided. The substrate processing pallet includes a base member, and an interface pad attachable to the base member. The interface pad has substantially the same coefficient of thermal expansion as the base member and adapted to facilitate cooling of the substrate. The substrate processing pallet also having a surface of the base member having features for aligning a substrate on the interface pad.

Abstract: A method of fluid sealing a workpiece is provided. The method includes providing a force to cause a ring to form a barrier to fluid entry with the workpiece and preventing fluid from crossing the barrier to fluid entry by forming a pressure differential across the barrier.

Abstract: A method of fluid sealing a workpiece is provided. The method includes placing a workpiece on a ring, engaging at least one engagement feature of the ring with at least one retaining feature defined by the member and flexing the member to provide a force to the at least one engagement feature to cause the ring to form a barrier to fluid entry with the workpiece.

Abstract: A method and apparatus for wetting the surface of a workpiece is disclosed. The apparatus includes a chamber with a vacuum port and a fluid port and a workpiece holder including a body, a ring, and a port. The body includes a surface and defines a cavity extending from the surface. The ring is adapted to retain the workpiece on the surface of body over the cavity. The ring forms a fluid seal relative to the workpiece and to the workpiece holder. The port is defined in the body and in communication with the cavity. The port affects pressure in the cavity to minimize a pressure differential between the front and back surfaces of the workpiece. The fluid port is in communication with the chamber. The fluid port delivers a fluid (e.g., a substantially degassed fluid) to wet the front surface of the workpiece during operation of the chamber at a reduced pressure relative to atmosphere.

Abstract: A method and apparatus for fluid sealing a workpiece retained by a workpiece holder are described. A pressure differential can be formed across a fluid seal to counteract fluid attempting to penetrate the fluid seal, which can contaminate the underside of the workpiece. The apparatus can include a ring forming a barrier to fluid entry with the workpiece and a source providing pressure to form the pressure differential. The pressure or the pressure differential can counteract hydroscopic fluid pressure or hydrostatic fluid pressure that is acting to force fluid through the barrier between the ring and the workpiece.

Abstract: A method and apparatus for retaining a workpiece against a workpiece holder are described. A flexible member can be used to provide a substantially uniform force to securely retain the workpiece, which can allow the workpiece to be consistently positioned in a process module. In one detailed embodiment, a barrier to fluid entry is formed between the workpiece and a ring for retaining the workpiece against a workpiece holder. This provides a reliable seal during fluid processing to prevent fluid from reaching the underside of a workpiece. In various embodiments, the workpiece holder can be used to align a workpiece in a process module or to hold one or more workpieces in a configuration that allows for higher throughput.

Abstract: A method and apparatus for retaining a workpiece against a workpiece holder are described. A flexible member can be used to provide a substantially uniform force to securely retain the workpiece, which can allow the workpiece to be consistently positioned in a process module. In one detailed embodiment, a barrier to fluid entry is formed between the workpiece and a ring for retaining the workpiece against a workpiece holder. This provides a reliable seal during fluid processing to prevent fluid from reaching the underside of a workpiece. In various embodiments, the workpiece holder can be used to align a workpiece in a process module or to hold one or more workpieces in a configuration that allows for higher throughput.

Abstract: An improved Bernoulli end effector for holding, handling, and transporting ultra-thin substrates includes edge guides to aid in the positioning of the substrate and may include friction pads that impede motion of the substrate lifted by the end effector. The Bernoulli end effector may be incorporated into an apparatus and method for supinating a substrate so that both surfaces of the substrate can be processed. In addition, the Bernoulli end effector may be used to place ultra-thin substrates on and retrieve substrates from a substrate handling structure that includes weights that prevent the substrates from bowing or flexing during processing and includes guides that prevent the ultra-thin substrates from moving or translating on the surface of the substrate handling structure.