Abstract: A technique and apparatus for heat dissipation in electrical devices is described. A bulk body may be configured with a plurality of radiating devices so that the bulk body may be divided into smaller bulk bodies to be used in conjunction with other electrical type assemblies to quickly and efficiently provide for a heat dissipation sub-assembly. In one aspect, the bulk bodies may be configured with internal voids such as a duct or tunnel interconnecting at least one input port and at least one output port for aiding in heat dissipation of an electrical device employing bulk body technique.

Abstract: A device for producing light may include one or more printed circuit boards (PCBs), an electronics package may be disposed about a first surface of one or more of the PCBs and a housing. A plurality of the PCBs may be set apart and connected by pins to dissipate heat from one PCB to another, and/or to convey electrical connectivity. Pins may be configured to pass through or into one or both the PCBs including the cores to conduct heat generated by the electronics package away for dispersion. In some embodiments, the pins may pass into the backplane. The PCBs may include LEDs, lights, computer devices, memories, telecommunications devices, or combinations of these. The device may also include a housing to contain the plurality of PCBs such that air flow may enter the housing and pass by the pins for cooling of the PCBs and electronics thereof.

Abstract: An apparatus is disclosed that may include a printed circuit board (PCB) and an electronics package may be disposed about the first surface of the PCB. The PCB may include a metal layer and a core, and, in some aspects, may include multiple cores interposed between multiple metal layers, and in some embodiments a backplane may be disposed along the core. The metal layer may be disposed on a core first surface. The metal layer may comprise metal or other conductive material suitable to define traces, which may be circuit paths for electronic components affixed to the PCB. In some aspects, the core may be electrically non-conducting, and may be thermally insulating, and, accordingly, inhibit the transfer of heat from the electronics package through the PCB. However, pins may be configured to pass through the PCB including the core from the core first surface to the core second surface to conduct heat generated by the electronics package away for dispersion.

Abstract: A light emitting diode (LED) lamp includes an LED cluster including LED groups arranged in series, a power source configured to provide an input power to the LED cluster, and a driving unit configured to adjust a number of the LED groups connected to a current path of the LED cluster in series based on the input power to the LED cluster.

Abstract: A technique and apparatus for heat dissipation in electrical devices is described. A bulk body may be configured with a plurality of radiating devices so that the bulk body may be divided into smaller bulk bodies to be used in conjunction with other electrical type assemblies to quickly and efficiently provide for a heat dissipation sub-assembly. In one aspect, the bulk bodies may be configured with internal voids such as a duct or tunnel interconnecting at least one input port and at least one output port for aiding in heat dissipation of an electrical device employing bulk body technique.

Abstract: A device is disclosed for producing light that may include one or more printed circuit boards (PCBs), an electronics package may be disposed about a first surface of one or more of the PCBs and a housing. A plurality of PCB's may be set apart and connected by pins to dissipate heat from one PCB to another, and/or to convey electrical connectivity. Pins may be configured to pass through or into one or both the PCBs including the cores to conduct heat generated by the electronics package away for dispersion. In some embodiments, the pins may pass into the backplane. The PCBs may include LEDs, lights, computer devices, memories, telecommunications devices, or combinations of these. The device may also include a housing to contain the plurality of PCBs such that air flow may enter the housing and pass by the pins for cooling of the PCBs and electronics thereof.

Abstract: Apparatus and methods for the thermal management of one or more light emitting diode (LED) modules disposed within a channel sign are disclosed. The apparatus, in various aspects, detects the ambient temperature generally proximate the LED module and regulates the current flowed onto the LED's within the LED module based upon the ambient temperature. Methods for thermal management of the one or more LED modules disposed within a channel sign are disclosed herein.

Abstract: An apparatus according to the present invention provides regulated pulsed current to an LED from a voltage source such as a rectified AC voltage. The present inventions provide methods for delivering regulated pulsed current to an LED from the voltage source.

Abstract: An apparatus is disclosed that may include one or more printed circuit boards (PCBs) and an electronics package may be disposed about the first surface of one or more of the PCBs. The PCBs may include a metal layer and a core, and, in some aspects, may include multiple cores interposed between multiple metal layers, and in some embodiments a backplane may be disposed along the core(s). A plurality of PCB's may be set apart and connected by pins to dissipate heat from one PCB to another, and/or to convey electrical connectivity. Pins may be configured to pass through or into one or both the PCBs including the cores to conduct heat generated by the electronics package away for dispersion. In some embodiments, the pins may pass into the backplane. The apparatus may include LEDs, lights, computer devices, memories, telecommunications devices, or combinations of these.

Abstract: Apparatus and methods for the thermal management of one or more light emitting diode (LED) modules disposed within a channel sign are disclosed. The apparatus, in various aspects, detects the ambient temperature generally proximate the LED module and regulates the current flowed onto the LED's within the LED module based upon the ambient temperature. Methods for thermal management of the one or more LED modules disposed within a channel sign are disclosed herein.

Abstract: An apparatus and related method for housing a light assembly apparatus includes a housing having a housing first end and a housing second end arranged along a central axis, the housing further includes a plurality of fins each having a fin first end and a fin second end, the plurality of fins forming a plurality of vents therebetween, each the plurality of fins has a curvature extending from the fin second end such that the plurality of fins converge towards the central axis proximate each fin first end, an endpiece proximate the housing first end and arranged proximate to the fin first end of each of the plurality of fins, the endpiece having a circular portion including a continuous circumference about the central axis, an electrical connector arranged proximate to the endpiece and arranged along the central axis, and a space arranged along the central axis proximate the housing second end and further configured with the plurality of fins and the plurality of vents arranged therearound, the space configured

Abstract: An apparatus is disclosed that may include one or more printed circuit boards (PCBs) and an electronics package may be disposed about the first surface of one or more of the PCBs. The PCBs may include a metal layer and a core, and, in some aspects, may include multiple cores interposed between multiple metal layers, and in some embodiments a backplane may be disposed along the core(s). A plurality of PCB's may be set apart and connected by pins to dissipate heat from one PCB to another, and/or to convey electrical connectivity. Pins may be configured to pass through or into one or both the PCBs including the cores to conduct heat generated by the electronics package away for dispersion. In some embodiments, the pins may pass into the backplane. The apparatus may include LEDs, lights, computer devices, memories, telecommunications devices, or combinations of these.

Abstract: An apparatus according to the present invention provides regulated pulsed current to an LED from a voltage source such as a rectified AC voltage. The present inventions provide methods for delivering regulated pulsed current to an LED from the voltage source.

Abstract: Apparatus and methods for the thermal management of one or more light emitting diode (LED) modules disposed within a channel sign are disclosed. The apparatus, in various aspects, detects the ambient temperature generally proximate the LED module and regulates the current flowed onto the LED's within the LED module based upon the ambient temperature. Methods for thermal management of the one or more LED modules disposed within a channel sign are disclosed herein.

Abstract: A lighting system is provided having a light source with a housing, an LED engine, a controller, a heat sink, a connection device, and a power cable opening. The LED engine, controller and heat sink can be enclosed by the housing and sealed from atmosphere. The heat sink can be in thermal communication with the LED engine. The controller can be connected to a power cable inserted through the power cable opening. The controller can control at least one of power to the LED engine and a light output generated by the LED engine. A fiber optic cable can be connected to the LED engine by the connection device. The LED engine can communicate the light output through the fiber optic cable.

Abstract: A light emitting diode (LED) lamp includes an LED cluster including LED groups arranged in series, a power source configured to provide an input power to the LED cluster, and a driving unit configured to adjust a number of the LED groups connected to a current path of the LED cluster in series based on the input power to the LED cluster.

Abstract: A housing for a plurality of light emitting diodes includes a housing providing a heat sink, where the heat sink includes a plurality of protrusions. A control board can be removably coupled to the heat sink and the control board can provide an aperture to receive a lens housing and an aperture to receive a coupling member to secure the control board to the heat sink. Further, a plurality of light emitting diode light engines can be mounted to the control board where the individual heat sink protrusions of the plurality of heat sink protrusions align with individual light engines of the plurality of light engines.