Abstract: Provided is a chip component manufacturing method which enables a plurality of chip pieces to be handled while being pasted to a sheet, and in which it is possible to apply at least a surface treatment to a plurality of chip pieces while being pasted to a sheet. This chip component manufacturing method comprises: a step for retaining a green sheet or the like on a carrier sheet; a step for cutting, together with a portion of the carrier sheet, the green sheet or the like retained on the carrier sheet; a step for removing, together with a portion of the carrier sheet, at least a dummy portion of the green sheet or the like that has been cut, so as to leave a plurality of chip pieces on the carrier sheet; and a step for applying at least a surface treatment to lateral surface portions of the plurality of chip pieces that have become exposed due to the removing while the plurality of chip pieces are being retained on the carrier sheet.

Abstract: Described herein is a method of bonding a piezoelectric substrate to a support substrate to form a composite substrate. The piezoelectric substrate has one surface which is positively polarized, and a second surface which is negatively polarized. The method described herein includes the steps of bonding the positively polarized surface of the piezoelectric substrate to one surface of the support substrate by a direct bonding method.

Abstract: Provided is a chip component manufacturing method which enables a plurality of chip pieces to be handled while being pasted to a sheet, and in which it is possible to apply at least a surface treatment to a plurality of chip pieces while being pasted to a sheet. This chip component manufacturing method comprises: a step for retaining a green sheet or the like on a carrier sheet; a step for cutting, together with a portion of the carrier sheet, the green sheet or the like retained on the carrier sheet; a step for removing, together with a portion of the carrier sheet, at least a dummy portion of the green sheet or the like that has been cut, so as to leave a plurality of chip pieces on the carrier sheet; and a step for applying at least a surface treatment to lateral surface portions of the plurality of chip pieces that have become exposed due to the removing while the plurality of chip pieces are being retained on the carrier sheet.

Abstract: In the composite substrate 10, the piezoelectric substrate 12 and the support substrate 14 are bonded by direct bonding using an ion beam. One surface of the piezoelectric substrate 12 is a negatively-polarized surface 12a and another surface of the piezoelectric substrate 12 is a positively-polarized surface 12b. An etching rate at which the negatively-polarized surface 12a is etched with a strong acid may be higher than an etching rate at which the positively-polarized surface 12b is etched with the strong acid. The positively-polarized surface 12b of the piezoelectric substrate 12 is directly bonded to the support substrate 14. The negatively-polarized surface 12a of the piezoelectric substrate 12 may be etched with the strong acid.

Abstract: In the composite substrate, the piezoelectric substrate and the support substrate are bonded by direct bonding using an ion beam. One surface of the piezoelectric substrate is a negatively-polarized surface and another surface of the piezoelectric substrate is a positively-polarized surface. An etching rate at which the negatively-polarized surface is etched with a strong acid may be higher than an etching rate at which the positively-polarized surface is etched with the strong acid. The positively-polarized surface of the piezoelectric substrate is directly bonded to the support substrate. The negatively-polarized surface of the piezoelectric substrate may be etched with the strong acid.

Abstract: A piezoelectric/electrostrictive (“PE”) actuator includes a PE element including a laminated object having a PE layer and a pair of electrodes arranged respectively on both sides of the PE layer, and having an operating part corresponding to the portion in which the PE layer is sandwiched between the pair of electrodes and a non-operating part corresponding to the portion in which the PE layer is not sandwiched between the pair of electrodes, and a moisture-proof film covering at least the vicinity of a boundary between the operating part and the non-operating part, consisting of a liquid with a saturated moisture content at 25 degree Celsius of 300 ppm or less and a withstand voltage at the saturated moisture content of not less than 6 kV/mm. The liquid contains hydrocarbon system organic compound having a main backbone of carbon-carbon bond and consisting only of carbon and hydrogen.

Abstract: A piezoelectric/electrostrictive (“PE”) actuator includes a PE element including a laminated object having a PE layer and a pair of electrodes arranged respectively on both sides of the PE layer, and having an operating part corresponding to the portion in which the PE layer is sandwiched between the pair of electrodes and a non-operating part corresponding to the portion in which the PE layer is not sandwiched between the pair of electrodes, and a moisture-proof film covering at least the vicinity of a boundary between the operating part and the non-operating part, consisting of a liquid with a saturated moisture content at 25 degree Celsius of 300 ppm or less and a withstand voltage at the saturated moisture content of not less than 6 kV/mm. The liquid contains hydrocarbon system organic compound having a main backbone of carbon-carbon bond and consisting only of carbon and hydrogen.

Abstract: In the composite substrate 10, the piezoelectric substrate 12 and the support substrate 14 are bonded by direct bonding using an ion beam. One surface of the piezoelectric substrate 12 is a negatively-polarized surface 12a and another surface of the piezoelectric substrate 12 is a positively-polarized surface 12b. An etching rate at which the negatively-polarized surface 12a is etched with a strong acid may be higher than an etching rate at which the positively-polarized surface 12b is etched with the strong acid. The positively-polarized surface 12b of the piezoelectric substrate 12 is directly bonded to the support substrate 14. The negatively-polarized surface 12a of the piezoelectric substrate 12 may be etched with the strong acid.

Abstract: The present invention provides a composite substrate comprising a piezoelectric substrate that is a single-crystal lithium tantalate or lithium niobate substrate, a support substrate that is a single-crystal silicon substrate, and an amorphous layer containing argon and joining together the piezoelectric substrate and the support substrate. The amorphous layer includes, in order from the piezoelectric substrate toward the composite substrate, a first layer, a second layer, and a third layer. The first layer contains a larger amount of a constituent element of the piezoelectric substrate than the second and third layers, the third layer contains a larger amount of a constituent element of the support substrate than the first and second layers, and the second layer contains a larger amount of argon than the first and third layers.

Abstract: A method of processing a sensor element includes the steps of: (a) preparing a gas atmosphere containing hydrocarbon, having an air-fuel ratio of 0.80 to 0.9999, and having a small amount of oxidizing gas added thereto; and (b) subjecting a sensor element to a heat treatment in the gas atmosphere at a temperature of 500° C. or higher for 15 minutes or longer. The sensor element includes an electrochemical pumping cell constituted of an oxygen-ion conductive solid electrolyte and an electrode having a NOx reduction ability. A NOx gas in a measurement gas is reduced or decomposed in the electrode. A NOx concentration in the measurement gas is obtained based on a current which flows in the electrochemical pumping cell at a time of the reduction or decomposition.

Abstract: A composite substrate according to the present invention includes a piezoelectric substrate that is a single-crystal lithium tantalate or lithium niobate substrate, a support substrate that is a single-crystal silicon substrate, and an amorphous layer joining together the piezoelectric substrate and the support substrate. The amorphous layer contains 3 to 14 atomic percent of argon. The amorphous layer includes, in order from the piezoelectric substrate toward the composite substrate, a first layer, a second layer, and a third layer. The first layer contains a larger amount of a constituent element (such as tantalum) of the piezoelectric substrate than the second and third layers. The third layer contains a larger amount of a constituent element (silicon) of the support substrate than the first and second layers. The second layer contains a larger amount of argon than the first and third layers.

Abstract: The present invention provides a composite substrate comprising a piezoelectric substrate that is a single-crystal lithium tantalate or lithium niobate substrate, a support substrate that is a single-crystal silicon substrate, and an amorphous layer containing argon and joining together the piezoelectric substrate and the support substrate. The amorphous layer includes, in order from the piezoelectric substrate toward the composite substrate, a first layer, a second layer, and a third layer. The first layer contains a larger amount of a constituent element of the piezoelectric substrate than the second and third layers, the third layer contains a larger amount of a constituent element of the support substrate than the first and second layers, and the second layer contains a larger amount of argon than the first and third layers.

Abstract: A method for manufacturing a gas sensor element includes (a) printing a wiring pattern of a conductive paste on a green sheet for an oxygen-ion conductive solid electrolyte; (b) laminating a plurality of green sheets including the green sheet having been subjected to step (a) and integrating the plurality of green sheets; (c) cutting out a plurality of element bodies from the laminated body; (d) baking the element body cut out by step (c); (e) heating the element body having been subjected to step (d), in a reducing atmosphere; (f) driving the element body having been subjected to step (e), in an inspection-purpose gas atmosphere for a predetermined time period; and (g) inspecting electrical characteristics of the element body having been subjected to step (f). The element body having passed the inspection of step (g) is assembled as a sensor element in a gas sensor.

Abstract: A method for improving an accuracy of measurement of the thickness of a green sheet, and additionally improving yield of a green sheet used for formation of a laminated body is provided. The thickness of each of a plurality of ceramic green sheets is measured, and an average and a variation of obtained thickness measurement values are checked against predetermined ranking criteria. Thereby, a ranking is performed in which the plurality of ceramic green sheets are classified into a plurality of ranks set in the ranking criteria. When forming the laminated body, only a ceramic green sheet belonging to at least one of the ranks which is in advance allowed to be used is used as a ceramic green sheet constituting each layer of the laminated body.

Abstract: An inspection apparatus including a cylindrical chamber having an opening part and a bottomed end part. The chamber includes an element insertion/extraction part, a tapered part, and a gas introduction part. The element insertion/extraction part is a tubular space continuous from the opening part. The tapered part is connected to the element insertion/extraction part, and is a space having a tapered shape in a cross-sectional view sectioned perpendicularly so that a lengthwise direction is larger toward the inner side. The gas introduction part is a tubular space continuously extending from the tapered part to a bottom portion. A sensor element is inserted into the chamber such that a front end thereof reaches the tapered part while a gap is formed between the sensor element and the chamber, and in this condition, an inspection gas is supplied to the chamber through a supply port provided in the gas introduction part.

Abstract: A method of processing a sensor element includes the steps of: (a) preparing a gas atmosphere containing hydrocarbon, having an air-fuel ratio of 0.80 to 0.9999, and having a small amount of oxidizing gas added thereto; and (b) subjecting a sensor element to a heat treatment in the gas atmosphere at a temperature of 500° C. or higher for 15 minutes or longer. The sensor element includes an electrochemical pumping cell constituted of an oxygen-ion conductive solid electrolyte and an electrode having a NOx reduction ability. A NOx gas in a measurement gas is reduced or decomposed in the electrode. A NOx concentration in the measurement gas is obtained based on a current which flows in the electrochemical pumping cell at a time of the reduction or decomposition.

Abstract: An inspection apparatus including a cylindrical chamber having an opening part and a bottomed end part. The chamber includes an element insertion/extraction part, a tapered part, and a gas introduction part. The element insertion/extraction part is a tubular space continuous from the opening part. The tapered part is connected to the element insertion/extraction part, and is a space having a tapered shape in a cross-sectional view sectioned perpendicularly so that a lengthwise direction is larger toward the inner side. The gas introduction part is a tubular space continuously extending from the tapered part to a bottom portion. A sensor element is inserted into the chamber such that a front end thereof reaches the tapered part while a gap is formed between the sensor element and the chamber, and in this condition, an inspection gas is supplied to the chamber through a supply port provided in the gas introduction part.

Abstract: A method for manufacturing a gas sensor element includes (a) printing a wiring pattern of a conductive paste on a green sheet for an oxygen-ion conductive solid electrolyte; (b) laminating a plurality of green sheets including the green sheet having been subjected to step (a) and integrating the plurality of green sheets; (c) cutting out a plurality of element bodies from the laminated body; (d) baking the element body cut out by step (c); (e) heating the element body having been subjected to step (d), in a reducing atmosphere; (f) driving the element body having been subjected to step (e), in an inspection-purpose gas atmosphere for a predetermined time period; and (g) inspecting electrical characteristics of the element body having been subjected to step (f). The element body having passed the inspection of step (g) is assembled as a sensor element in a gas sensor.

Abstract: A method for improving an accuracy of measurement of the thickness of a green sheet, and additionally improving yield of a green sheet used for formation of a laminated body is provided. The thickness of each of a plurality of ceramic green sheets is measured, and an average and a variation of obtained thickness measurement values are checked against predetermined ranking criteria. Thereby, a ranking is performed in which the plurality of ceramic green sheets are classified into a plurality of ranks set in the ranking criteria. When forming the laminated body, only a ceramic green sheet belonging to at least one of the ranks which is in advance allowed to be used is used as a ceramic green sheet constituting each layer of the laminated body.

Abstract: A method of manufacturing a gas sensor includes a step of printing a measuring electrode pattern on a ceramic green sheet for forming a measuring electrode, and a step of printing an electrode protection layer pattern on the measuring electrode pattern. The step of forming the protection layer pattern is performed by repeatedly printing a unit layer pattern several times by using a protection layer forming paste with ceramic powder mixed with a pore-forming agent in a predetermined ratio. A ratio of the pore-forming agent in the protection layer forming paste used for forming at least either one of a bottom unit layer pattern and an uppermost unit layer pattern is made larger than that of the pore-forming agent in the protection layer forming paste used for forming a unit layer pattern of other layers.