Abstract: A method for making a piezoelectric device wherein residual stresses in the piezoelectric transducer element of the piezoelectric device are relieved by forming a groove or grooves extending into a thick-walled region of the peripheral wall of a ceramic substrate in the piezoelectric device. The stresses to be relieved are caused by a difference in shrinkage between the ceramic substrate and the piezoelectric transducer as a result of sintering the substrate and the transducer to form an integral product.
Type:
Grant
Filed:
June 8, 1994
Date of Patent:
July 1, 2003
Assignees:
NGK Indulators, LTD, Seiko Epson Corp.
Inventors:
Natsumi Shimogawa, Koji Kimura, Yukihisa Takeuchi