Patents Assigned to NHK Spring R & D Center Inc.
  • Patent number: 5768679
    Abstract: An article essentially consisting of one or more of Ti-Al intermetallic compounds is fabricated so as to have a volume ratio of voids of 0.2 to 3.5% and a maximum size of voids less than 50 .mu.m, by preparing a mixture of materials selected from a group consisting of Ti, Ti alloys, Al, Al alloys, and Ti-Al compounds, having a composition suitable for forming a desired Ti-Al intermetallic compound, and heating the mixture so that the mixture may be sintered. Typically, the temperature and pressure for the heating or sintering process, and the particle size of the material are appropriately selected so that a desired porosity and a desired range of void sizes may be obtained. The mechanical strength of the article according to the present invention is not only improved (as compared to the conventional Ti-Al intermetallic compounds) but is highly predictable, or, in other words, highly reliable.
    Type: Grant
    Filed: September 3, 1996
    Date of Patent: June 16, 1998
    Assignee: NHK Spring R & D Center Inc.
    Inventors: Kohei Taguchi, Michihiko Ayada, Hideo Shingu