Patents Assigned to Nihon Alimit Co., Ltd.
  • Pb-free soldering alloy
    Patent number: 6692691
    Abstract: A Pb-free soldering alloy that does not include any Pb is provided. The soldering alloy prevents Cu present in a printed-circuit board from combining with Ni in the soldering alloy at the soldered part, prevents Cu from precipitating and diffusing in the soldering alloy, suppresses the generation of fine cracks at the soldered part and increases the mechanical strength of the soldered part. The Pb-free soldering alloy contains 3.5 to 6.0 wt. % Ag, 0.001 to 1.0 wt. % Ni and Sn for the balance.
    Type: Grant
    Filed: June 29, 2001
    Date of Patent: February 17, 2004
    Assignees: Nihon Alimit Co., Ltd., Matsushita Electric Industrial Co., Ltd.
    Inventors: Tadashi Sawamura, Hisashi Komiya, Tsuguo Inazawa, Fujio Nakagawa