Patents Assigned to Nihon Cabot Microelectronics K.K.
  • Slurry composition and method for polishing substrate
    Patent number: 9914853
    Abstract: Provided are a slurry composition to be used in chemical mechanical polishing (CMP), and a method for polishing a substrate. This slurry composition contains water, abrasive grains, and an alkylene polyalkylene oxide amine polymer having a solubility parameter in a range of 9-10. A preferred alkylene polyalkylene oxide amine polymer is given by general formula (1). (In general formula (1), m and n are positive integers, and A and R are alkylene oxide groups.
    Type: Grant
    Filed: March 17, 2015
    Date of Patent: March 13, 2018
    Assignee: Nihon Cabot Microelectronics K.K.
    Inventors: Tsuyoshi Masuda, Hiroshi Kitamura, Yoshiyuki Matsumura