Abstract: A pressure-sensitive adhesive for use in temporarily securing electronic devices, particularly surface-mounting devices onto a printed circuit board in position during soldering, thereby preventing the devices from dropping from the board. The pressure-sensitive adhesive consists essentially of a resinous material having a dynamic modulus of elasticity in the range of from 10.sup.4 to 10.sup.9 dyne/cm.sup.2 as measured at the soldering temperature of the electronic devices with a frequency of applied vibrations of 10 Hz. Preferably, the resinous material has a dynamic modulus of elasticity in the range of from 10.sup.4 to 10.sup.7 dyne/cm.sup.2 and a value for tan .delta. of greater than 0.2 as measured under the above conditions. In this case, the pressure-sensitive adhesive exhibits a self-aligning effect whereby electronic devices mounted out of position on the board are forced to move toward the proper positions by the action of the surface tension of a molten solder.

Abstract: A composition for treating leather, fur and fibrous material which comprises a water-soluble and/or a water-dispersible polyurethane, and more particularly a composition comprising the following ingredients a), b), c) and d) in the following proportions:______________________________________ ingredient a); water-soluble and 5.0-100% by wt. water-dispersible polyurethane ingredient b); salt of divalent to 0.0-20% by wt. tetravalent metal ingredient c); surfactant 0.0-40% by wt. ingredient d); auxiliary ingredients 0.0-40% by wt. ______________________________________Leather and fur treated with the treating agent of the invention can be washed in water. Even when washed in water, they retain flexibility, have an excellent dimensional stability and are enhanced in water absorption into leather fiber. Further, they are improved in tear strength, tensile strength and hand and become easy to sew by means of a domestic sewing machine.

Abstract: A pressure-sensitive adhesive for use in temporarily securing electronic devices, particularly surface-mounting devices onto a printed circuit board in position during soldering, thereby preventing the devices from dropping from the board. The pressure-sensitive adhesive consists essentially of a resinous material having a dynamic modulus of elasticity in the range of from 10.sup.4 to 10.sup.9 dyne/cm.sup.2 as measured at the soldering temperature of the electronic devices with a frequency of applied vibrations of 10 Hz. Preferably, the resinous material has a dynamic modulus of elasticity in the range of from 10.sup.4 to 10.sup.7 dyne/cm.sup.2 and a value for tan .delta. of greater than 0.2 as measured under the above conditions. In this case, the pressure-sensitive adhesive exhibits a self-aligning effect whereby electronic devices mounted out of position on the board are forced to move toward the proper positions by the action of the surface tension of a molten solder.

Abstract: An alkaline cell having a gelled zinc negative electrode solely or mainly using, as a gelling agent to hold a zinc powder in an alkaline electrolyte, a granular crosslinking type branched polyacrylic acid, polymethacrylic acid or salts thereof.This gelling agent, holding an alkaline electrolyte, swells and properly maintains the thickness of the electrolyte, whereby the electrolyte can be sufficiently fed to a cell reaction portion and the alkaline cell is imparted with excellent drop resistance and shelf stability.