Abstract: An apparatus and method for controlling an electromagnet for a magnetron sputtering source controls electric currents flowing through a central coil and an inner peripheral coil of the electromagnet to flow in the same direction. Further, the direction of the electric current flowing through an outer peripheral coil is made to flow in the same direction as, and in the opposite direction to, the electric currents through the central coil and the inner peripheral coil. Therefore, the magnetic field to be generated in a space near the surface of the target moves between the central portion and the peripheral portion thereof each time the direction of the electric current flowing through the outer peripheral coil is reversed. Since the of high density plasma also moves in accordance with the magnetic field, the area of the target which is sputtered becomes wider and the efficiency of utilization of the target is improved.