Patents Assigned to Nihon Speriasha Co., Ltd.
  • Low-temperature solder composition
    Patent number: 4816219
    Abstract: A conventional solder composition of Sn--Bi--Pb which is improved so that, when soldering job at a lower temperature, adequate adhesion strength and a resilient bond is obtained by virtue of additional incorporation of 0.005 to 1% GA and/or 0.01 to 0.1% Ni. The inventive solder is useful in assembly work in the electronic industry wherein thermally weak parts are subjected to soldering.
    Type: Grant
    Filed: June 12, 1987
    Date of Patent: March 28, 1989
    Assignee: Nihon Speriasha Co., Ltd.
    Inventor: Tetsuro Nishimura