Patents Assigned to Nihon Kagaku Sangyo Co., Ltd.
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Publication number: 20240055616Abstract: The present invention provides a supported metal catalyst that has an electric conductivity acceptable as a catalyst and can suppress the generation of hydrogen peroxide. According to the present invention, provided is a supported metal catalyst, comprising: a support powder; and metal fine particles supported on the support powder, wherein: the support powder is an aggregate of support fine particles; the support fine particles have a chained portion structured by a plurality of crystallites being fusion-bonded to form a chain; the support fine particles are structured with a metal oxide; the metal oxide contains cerium; and an electric conductivity of the supported metal catalyst is 10?4 S/cm or higher.Type: ApplicationFiled: December 23, 2021Publication date: February 15, 2024Applicants: UNIVERSITY OF YAMANASHI, NIHON KAGAKU SANGYO CO., LTD.Inventors: Katsuyoshi KAKINUMA, Akihiro IIYAMA, Makoto UCHIDA, Sumitaka WATANABE, Isao AMEMIYA
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Patent number: 11752490Abstract: A support powder can improve cell performance under high humidity environment. A support and metal catalyst, including: a support powder; and metal fine particles supported on the support powder; wherein: the support powder is an aggregate of support fine particles; the support fine particles are fine particles of oxide compound and has a chained portion structured by a plurality of crystallites being fusion bonded to form a chain; the crystallites have a size of 10 to 30 nm; the support powder has a void; the void includes a secondary pore having a pore diameter of more than 25 nm and 80 nm or less determined by BJH method; and a volume of the secondary pore per unit volume of the support fine particles structuring the support powder is 0.313 cm3/cm3 or more, is provided.Type: GrantFiled: October 16, 2019Date of Patent: September 12, 2023Assignees: Nihon Kagaku Sangyo, Co, Ltd., University of YamanishiInventors: Chisato Arata, Hajime Kashima, Katsuyoshi Kakinuma, Makoto Uchida, Akihiro Iiyama
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Publication number: 20230006219Abstract: A support and metal catalyst with improved electric conductivity is provided. A support and metal catalyst, including: a support powder; and metal fine particles supported on the support powder; wherein: the support powder is an aggregate of support fine particles; the support fine particles have a chained portion structured by a plurality of crystallites being fusion bonded to form a chain; the support fine particles are structured with metal oxide; and the metal oxide is doped with a dopant element, and an atomic ratio of titanium with respect to total of titanium and tin is 0.30 to 0.80, is provided.Type: ApplicationFiled: December 10, 2020Publication date: January 5, 2023Applicants: UNIVERSITY OF YAMANASHI, NIHON KAGAKU SANGYO CO., LTD.Inventors: Katsuyoshi KAKINUMA, Makoto UCHIDA, Akihiro IIYAMA, Isao AMEMIYA, Chisato ARATA, Sumitaka WATANABE
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Publication number: 20210339224Abstract: A support powder can improve cell performance under high humidity environment. A support and metal catalyst, including: a support powder; and metal fine particles supported on the support powder; wherein: the support powder is an aggregate of support fine particles; the support fine particles are fine particles of oxide compound and has a chained portion structured by a plurality of crystallites being fusion bonded to form a chain; the crystallites have a size of 10 to 30 nm; the support powder has a void; the void includes a secondary pore having a pore diameter of more than 25 nm and 80 nm or less determined by BJH method; and a volume of the secondary pore per unit volume of the support fine particles structuring the support powder is 0.313 cm3/cm3 or more, is provided.Type: ApplicationFiled: October 16, 2019Publication date: November 4, 2021Applicants: Nihon Kagaku Sangyo Co., Ltd., University of YamanashiInventors: Chisato Arata, Hajime Kashima, Katsuyoshi Kakinuma, Makoto Uchida, Akihiro Iiyama
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Patent number: 4115211Abstract: Metal plated aluminum product with good adhesion between aluminum substrate and plated metal are found to be producible by the process which comprises: electrolyzing aluminum or aluminum alloys by A.C. or superimposed A.C. and D.C. in an electrolytic solution capable of producing a growth type or barrier type anodic oxide coating onto the surface of the aluminum or aluminum alloy and comprising an aqueous solution containing a water-soluble acid and a water-soluble heavy metal salt, thereby to impart good adhesion properties to the aluminum or aluminum alloy surface and render it suitable as a substrate for plating of additional metal thereon, metal plating on the resulting aluminum substrate, and subjecting said plated substrate to a heat treatment to enhance the adhesion between the substrate and the additional metal plated thereon.Type: GrantFiled: December 22, 1976Date of Patent: September 19, 1978Assignee: Nihon Kagaku Sangyo Co., Ltd.Inventors: Takeo Tsukamoto, Miyoshi Okamura, Toshio Kutami