Patents Assigned to Niken Corporation
  • Polishing apparatus and method with constant polishing pressure
    Patent number: 6270392
    Abstract: In an apparatus for polishing a substrate, including a polishing platen for mounting the substrate thereon, a polishing head, a polishing pad adhered to a bottom face of the polishing head, and a rocking section for rocking. I.e., moving the polishing head in the horizontal direction with respect to the polishing platen, a control circuit controls a load of the polishing pad applied to the substrate in accordance with a contact area of the polishing pad to the substrate.
    Type: Grant
    Filed: June 18, 1999
    Date of Patent: August 7, 2001
    Assignees: NEC Corporation, Niken Corporation
    Inventors: Yoshihiro Hayashi, Takahiro Onodera, Yamato Samitsu, Kiyoshi Tanaka, Naoki Sasaki