Abstract: The object is to provide a carrier showing superior adhesion property and detachability, which is suitable for transferring a cell sheet. A carrier for transferring a cell sheet for transplantation comprising a cell sheet-adhesive coating layer that can respond to a non-cytotoxic condition and a support layer consisting of a base material acceptable as a medical material is provided. By applying a cell sheet adhering to the coating layer of the carrier to a transplantation site and providing the non-cytotoxic condition, the carrier can be detached and removed with maintaining the cell sheet at the transplantation site.

Abstract: A packing paper for baker's yeast, which is constituted by laminating, on one side of a base paper, at least a printing layer and a wax layer in this order and which has a carbon dioxide permeability of 400-2,000 cm.sup.3 /m.sup.2 .multidot.24 h.multidot.atm., an oxygen permeability of 100-600 cm.sup.3 /m.sup.2 .multidot.24 h.multidot.atm. and a moisture permeability of 50 g/m.sup.2 .multidot.24 h or less.

Abstract: Disclosed herein is a flexible printed circuit board and coverlay film and a method for producing the same. The board and coverlay film have metal foil or parting paper adhered to a polyimide film using a two-layer thermosetting adhesive. The first layer of adhesive on the polyimide film is about 5 .mu.m thick or less. The circuit board and coverlay film produced according to this invention have excellent bonding strength, thermal, chemical and weather resistance, as well as good insulating properties.

Abstract: Disclosed herein is a flexible printed circuit board and coverlay film and a method for producing the same. The board and coverlay film have metal foil or parting paper adhered to a polyimide film using a two-layer thermosetting adhesive. The first layer of adhesive on the polyimide film is about 5 .mu.m thick or less. The circuit board and coverlay film produced according to this invention have excellent bonding strength, thermal, chemical and weather resistance, as well as good insulating properties.

Abstract: A process for producing silver-coated potassium titanate fibers comprises admixing the potassium titanate fibers with a silver ion solution containing a reducing agent. The resulting silver-coated potassium titanate fibers can, if desired, be provided with one or more additional metal coatings superimposed on the silver coat wherein the additional metal is other than silver.

Abstract: There is provided a board for additive circuits which is formed with plural convexo-concave irregularities on the surface of an inorganic composite plate wherein a needle-like or fiber-like inorganic material is present as a mixture with an isotropic solid vitreous inorganic material while maintaining its needle-like or fiber-like form.

Abstract: There is prepared in inorganic composite containing a needle-like inorganic material or a fiber-like inorganic material which is present as a mixture in isotropic solid vitreous inorganic material while maintaining its needle-like or fiber-like structure. The inorganic composite is prepared by a process comprising the steps ofkneading a mixture containing a vitreous inorganic material and a needle-like or fiber-like inorganic material which does not melt at the softening point of the vitreous material;molding the mixture into a predetermined shape; andcalcining the molded mixture at a temperature higher than the softening point of the vitreous inorganic material and below the melting point of said needle-like or fiber-like inorganic material.

Abstract: The present invention relates to a substrate for a printed circuit exhibiting particularly an excellent electrical insulating property, as well as an excellent heat dissipating property and heat resistance.In accordance with the present invention, a substrate of a printed circuit comprises a metallic plate, and further comprising on at least one surface of said metallic plate, a synthetic resin layer containing an inorganic filler, a heat-resistant resin film, and a synthetic resin layer, which are successively laminated on said metallic plate.A substrate of the present invention also comprises a metallic plate, at least two synthetic resin layers containing an inorganic filler, a heat-resistant resin film which is laminated between said at least two synthetic resin layers.